Abstract
To accurately simulate modern semiconductor process steps, TCAD tools must include a variety of physical models and numerical methods. Increasingly complex physical formulations are required to account for effects that were not important in previous generation of technology. As a specific example, the impurity diffusion mechanisms owing to point defects and damage kinetics are not well understood, and thus flexibility in definition of models is highly desirable. An object-oriented approach has been applied to implementing a 1-2-3D finiteelement dial-an-operator PDE solver. The control interface is based on Tcl and allows layered access to model definitions and solution techniques.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
B.J. Mulvaney, et. al., PEPPER 1.2 User Manual, MCC Tech. Rep. CAD-239-90, 1989.
J.K. Ousterhout, Tcl and the Tk Toolkit, Addison-Wesley, 1994.
S. Bebee, et. al., “Next-generation Stanford TCAD — PISCES 2ET and SUPREM 007, ” IEDM Technical Digest, 1994, p. 213.
D.W. Yergeau, R.W. Dutton and R.J.G. Goossens, “A General OO-PDE Solver for TCAD Applications, ”OONSKI 94, Mar. 1994, Oregon.
W.B. Richardson and B.J. Mulvaney, “Plateau and kink in P profiles diffused into Si: A result of strong bimolecular recombination?, ”Appl. Phys. Lett., vol. 53, no. 20, pp. 1917–1919, 1988.
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1995 Springer-Verlag Wien
About this paper
Cite this paper
Yergeau, D.W., Kan, E.C., Gander, M.J., Dutton, R.W. (1995). ALAMODE: A Layered Model Development Environment. In: Ryssel, H., Pichler, P. (eds) Simulation of Semiconductor Devices and Processes. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6619-2_15
Download citation
DOI: https://doi.org/10.1007/978-3-7091-6619-2_15
Publisher Name: Springer, Vienna
Print ISBN: 978-3-7091-7363-3
Online ISBN: 978-3-7091-6619-2
eBook Packages: Springer Book Archive