Abstract
New process concepts require multiple implantations into the same volume of Si with only one annealing step after all implantations have been performed. Moreover, there is a trend towards BF2 implantation for shallow p-doping. We have extended the Monte Carlo simulator IMSIL to consider for each implantation the accumulated lattice damage of all previous implantation steps, and we have determined the parameters of the stopping power and damage accumulation models for BF2 ions. The influence of the cummulative damage on the implantation profiles and on the threshold voltage behavior is discussed for a specific PMOS device.
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© 1995 Springer-Verlag Wien
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Simionescu, A., Hobler, G., Lau, F. (1995). Monte Carlo Simulation of Multiple-Species Ion Implantation and its Application to the Modeling of 0.1µ PMOS Devices. In: Ryssel, H., Pichler, P. (eds) Simulation of Semiconductor Devices and Processes. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6619-2_117
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DOI: https://doi.org/10.1007/978-3-7091-6619-2_117
Publisher Name: Springer, Vienna
Print ISBN: 978-3-7091-7363-3
Online ISBN: 978-3-7091-6619-2
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