Advertisement

Advanced Hybrid Cellular Based Approach for Three-Dimensional Etching and Deposition Simulation

  • A. Hössinger
  • T. Binder
  • W. Pyka
  • S. Selberherr

Abstract

For the simulation of etching and deposition processes the cellular method is very popular, because of its high robustness compared to alternative methods like the level set or the moving boundary approach. We present a method for the simulation of topography processes based on the cellular method that overcomes the problem of loss of information when using a cellular based simulator in combination with simulators using polygonal data representations. Additionally the new method allows to increase the resolution of the topography simulator without a significantly higher memory requirement.

Keywords

Simulation Domain Refined Cell Gate Oxide Thickness Cellular Resolution Deposition Simulation 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. [1]
    W. Pyka, R. Martins, and S. Selberherr, "Optimized Algorithms for Three-Dimensional Cellular Topography Simulation:' IEEE J. Technology Computer Aided Design 2000. http://www.ieee.org/products/online/journal/tcad/accepted/PykaMarch00/ . Google Scholar
  2. [2]
    E. Strasser and S. Selberherr, "Algorithms and Models for Cellular Based Topography Simulation," IEEE Trans.Computer-Aided Design vol. 14, no. 9, pp. 1104-1114, 1995.CrossRefGoogle Scholar
  3. [3]
    T. Binder and S. Selberherr, "Object-Oriented Wafer-State Services:” in 14th European Simulation Multiconference (R. V. Landeghem, ed.), (Ghent, Belgium), pp. 360-364, Society for Computer Simulation International, May 2000.Google Scholar
  4. [4]
    P. Lindstrom and G. Turk", "Fast and Memory Efficient Polygonal Simplification," in Proceedings of IEEE Visualization vol. 98, pp. 279-286, 1998.Google Scholar

Copyright information

© Springer-Verlag Wien 2001

Authors and Affiliations

  • A. Hössinger
    • 1
  • T. Binder
    • 1
  • W. Pyka
    • 1
  • S. Selberherr
    • 1
  1. 1.TU ViennaInstitute for MicroelectronicsVienna, Austria

Personalised recommendations