Abstract
In this paper, we report three-dimensional modeling of the sputter deposition process for ULSI interconnects. The numerical method in this work is based upon the level-set scheme for accurately tracking the moving boundaries of the deposited profiles. A new approach is proposed in an effort to reduce thecalculating CPU time during the calculating step of the deposition rate. Our simulation incorporates three-dimensional direct and/or indirect flux distributions and shadow-effects as well as the dependence of sticking coefficient that affects not only the thickness of film at different position but also the initiation of the creation of a void. In this work, we present several numerical examples for copper deposition process, which include L-shaped trenches and contact holes with different aspect ratios.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Reference
E. Bar and 1. Lorenz, Proc. SISPAD ’99, 75 (1999).
1. A. Sethian, Level Set Methods (Cambridge University Press, USA, 1996).
Youngchan Ban,, 1. Korean Phys.Soc., 35, S829 (1999).
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2001 Springer-Verlag Wien
About this paper
Cite this paper
Kwon, O., Won, T. (2001). Level Set Modeling of Profile Evolution During Deposition Process. In: Tsoukalas, D., Tsamis, C. (eds) Simulation of Semiconductor Processes and Devices 2001. Springer, Vienna. https://doi.org/10.1007/978-3-7091-6244-6_80
Download citation
DOI: https://doi.org/10.1007/978-3-7091-6244-6_80
Publisher Name: Springer, Vienna
Print ISBN: 978-3-7091-7278-0
Online ISBN: 978-3-7091-6244-6
eBook Packages: Springer Book Archive