3D Thermal Analysis for SOI and its impact on Circuit Performance
3D-thermal analysis for multifinger devices is developed for partially depleted SOI and Cu interconnects. Using this technique the temperature rise for multifinger devices is at least a factor of 3 higher than predicted by I-D thermal resistance models.
Also increase in temperature degrades the performance incrementally.
KeywordsSolder Bump Clock Tree Spice Model Active Finger Steady State Temperature Distribution
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