Spectroscopic Evaluation of Layered Substrates
In this paper an ultrasonic method to evaluate bond quality between a layer of substrate is suggested. The method uses guided modes in the layered substrate structure, rather than the conventional bulk waves. It is demonstrated that the interface quality between the layer and the substrate can be monitored by the dispersion behavior of the lowest mode’s phase velocity. Both dissimilar and similar material combinations of layer and substrate with various bonding conditions are investigated.
KeywordsDispersion Curve Rayleigh Wave Zinc Oxide Silicon Layer Aluminum Substrate
Unable to display preview. Download preview PDF.
- 1.Farnell G.W. and E.L. Adler: Physical Acoustics, Academic Press, New York 1972.Google Scholar
- 3.Ko, R., P.B. Nagy and L. Adler: Experimental Study of Interface properties Between Layer and Substrate, Review of Progress in Quantitative NDE, IIB (1992), 1967.Google Scholar
- 4.Balk, J.M. and R.B. Thompson: Ultrasonic Scattering from Imperfect Interface a Quasi-Static Model, Journal of NonDestructive Evaluation, 4 (1985), 177.Google Scholar