Spectroscopic Evaluation of Layered Substrates

  • L. Adler
Part of the CISM International Centre for Mechanical Sciences book series (CISM, volume 330)


In this paper an ultrasonic method to evaluate bond quality between a layer of substrate is suggested. The method uses guided modes in the layered substrate structure, rather than the conventional bulk waves. It is demonstrated that the interface quality between the layer and the substrate can be monitored by the dispersion behavior of the lowest mode’s phase velocity. Both dissimilar and similar material combinations of layer and substrate with various bonding conditions are investigated.


Dispersion Curve Rayleigh Wave Zinc Oxide Silicon Layer Aluminum Substrate 


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Copyright information

© Springer-Verlag Wien 1993

Authors and Affiliations

  • L. Adler
    • 1
  1. 1.The Ohio State UniversityColumbusUSA

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