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Numerical Wave Analysis for the Line Focus Acoustic Microscope: A Measurement Model

  • J. D. Achenbach
  • V. S. Ahn
  • J. O. Kim
  • J. G. Harris
Part of the CISM International Centre for Mechanical Sciences book series (CISM, volume 330)

Abstract

A combined numerical and analytical model for the voltage measured by a line focus acoustic microscope as it scans the surface of a specimen is described. Particular emphasis is placed upon integration of the various parts into the total measurement model. Specimens having surface-breaking and subsurface cracks are considered as are ones coated by a thin film. The scanning acoustic microscope holds out the promise of quantitative measurements of very localized near surface properties, and of surface and near surface defects whose lengths are of the the order of a few microns.

Keywords

Boundary Element Method Rayleigh Wave Crack Depth Particle Displacement Subsurface Crack 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

  1. 12.1.
    Achenbach, J.D., V.S. Ahn and J.G. Harris: Wave analysis of the acoustic material signature for the line focus microscope, IEEE Ultrason. Ferroelect. Freq. Contr. 34, (1991) 380–387.CrossRefGoogle Scholar
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    Ahn, V.S., J.G. Harris and J.D. Achenbach: Numerical analysis of he acoustic signature of a surface-breaking crack, IEEE Ultrason. Ferroelect. Freq. Contr. 39 (1991) 112–118.Google Scholar
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    Ahn, V.S., J.D. Achenbach, Z.L. Li and J.O. Kim: Numerical modeling of the V(z) curve for a thin-layer/substrate configuration, Res. Nondestr. Eval. 3 (1991) 183–200.Google Scholar
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Copyright information

© Springer-Verlag Wien 1993

Authors and Affiliations

  • J. D. Achenbach
    • 1
  • V. S. Ahn
    • 1
  • J. O. Kim
    • 1
  • J. G. Harris
    • 2
  1. 1.Northwestern UniversityEvanstonUSA
  2. 2.University of IllinoisUrbanaUSA

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