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New Developments in Spatially Multidimensional Ion Microprobe Analysis

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Progress in Materials Analysis

Part of the book series: Mikrochimica Acta ((MIKROCHIMICA,volume 10))

Abstract

Due to the combination of lateral imaging properties, localized ion emission and controlled removal of surface layers, ion microprobe mass spectrometry inherently is capable of spatially 3-dimensional constitutional solids analysis. Attempts to utilize this capability have been reported in the literature1, 2. However, only the computerization of microprobe operation and the developments in on-line storage of a large number of digitized ion micrographs, together with the developments of digital image processing and display algorithms, made 3-dimensional distribution analysis a feasible mode of solids characterization.

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References

  1. E. Berkey, in Microstructural Analysis, J. L. McCall and W. M. Mueller (eds.). New York: Plenum Press. 1973.

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Author information

Authors and Affiliations

  1. Österreichisches Forschungszentrum Seibersdorf and Institut für Experimentalphysik, Universität Wien, Austria

    W. Steiger, Prof. Dr. F. G. Rüdenauer, H. Gnaser, P. Pollinger & H. Studnicka

  2. Österreichisches Forschungszentrum Seibersdorf, Lenaugasse 10, A-1082, Wien, Austria

    Prof. Dr. F. G. Rüdenauer

Authors
  1. W. Steiger
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  2. Prof. Dr. F. G. Rüdenauer
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  3. H. Gnaser
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  4. P. Pollinger
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  5. H. Studnicka
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Editor information

Editors and Affiliations

  1. Technical University of Vienna, Austria

    M. Grasserbauer (Chairman) (Chairman)

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© 1983 Springer-Verlag Wien

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Steiger, W., Rüdenauer, F.G., Gnaser, H., Pollinger, P., Studnicka, H. (1983). New Developments in Spatially Multidimensional Ion Microprobe Analysis. In: Grasserbauer, M., Zacherl, M.K. (eds) Progress in Materials Analysis. Mikrochimica Acta, vol 10. Springer, Vienna. https://doi.org/10.1007/978-3-7091-3943-1_9

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  • DOI: https://doi.org/10.1007/978-3-7091-3943-1_9

  • Publisher Name: Springer, Vienna

  • Print ISBN: 978-3-211-81759-9

  • Online ISBN: 978-3-7091-3943-1

  • eBook Packages: Springer Book Archive

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