Abstract
Spatially periodic or quasi-periodic heat sources mounted on a laminate are often found in electronic equipment. Power transistors mounted on a cold plate and thermo-electric cooler cells are prominent examples. The solution presented here models these sources as a periodic temperature wave on one surface of a laminate; the other surface is open to convection and the convective heat transfer is assumed to be constant. An equation describing the temperature field is derived which leads to an exact solution for the heat transfer rate. Implications of the solution are discussed with reference to the design of electronic circuit boards.
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References
Carslaw, H. S. and Jaeger, J.C. (1959) Conduction of Heat in Solids, Clarendon, Oxford, pp. 180–182.
Ellison, G.N. (1990) ‘Methodologies for Thermal Analysis of Electronic Components and Systems’, to be published in A. Bar-Cohen and A.D. Kraus (eds.), Advances in Thermal Modeling of Electronic Components and Systems, Vol. I II, Hemisphere, New York.
Pinto, E.J. and Mikic, B.B. (1986) ‘Temperature Prediction on Substrates and Integrated Circuit Chips’, AIAA/ASME 4th Thermophysics and Heat Transfer Conference, HTD, Vol. 57, pp. 199–207.
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© 1992 Springer Fachmedien Wiesbaden
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Davies, M.R.D., Punch, J., Rodgers, P. (1992). Three Dimensional Conductive Heat Transfer from Discrete Periodic Sources to a Convective Sink. In: Hodnett, F. (eds) Proceedings of the Sixth European Conference on Mathematics in Industry August 27–31, 1991 Limerick. European Consortium for Mathematics in Industry. Vieweg+Teubner Verlag, Wiesbaden. https://doi.org/10.1007/978-3-663-09834-8_23
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DOI: https://doi.org/10.1007/978-3-663-09834-8_23
Publisher Name: Vieweg+Teubner Verlag, Wiesbaden
Print ISBN: 978-3-663-09835-5
Online ISBN: 978-3-663-09834-8
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