Abstract
An infrared focal plane array (IRFPA) is an advanced imaging sensor with the ability to detect, acquire, and process infrared information. Generally, an IRFPA is composed of a photodiode array and specific readout integrated circuits.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Bai Y, Bernd SG, Hosack JR, et al. Hybrid CMOS focal plane array with extended UV and NIR response for space applications. In: SPIE’s 48th annual meeting, 3–8 Aug 2003, San Diego, CA.
Andresen BF, Fulop GF, Norton PR. The architecture and performance of SCD’s 17 μm pitch VOx μ-bolometer detector. In: Proceedings of SPIE. vol. 7298. 2009. 72980R.
Andresen BF, Strojnik M. Standardized high-performance 640 × 512 readout integrated circuit for infrared applications. In: Proceedings of SPIE. vol. 3698. 1999. pp. 766–777.
Smith EPG, Bornfreund RE, Kasai I, et al. Status of two-color and large format HgCdTe FPA technology at Raytheon vision system. In: Proceedings of SPIE. vol. 6127. 2006. 61271F.
Reine MB,Hairston A,Dette PO,et al. Simultaneous MW/LW dual-band MOVPE HgCdTe 64x64 FPAs. In: Proceedings of SPIE. vol. 3379. 1998. pp. 200–212.
Baylet P, Zanatta J-P, Chance D, et al. Recent advances in the development of infrared multispectral 1282 FPAs. In: Proceedings of SPIE. vol. 4721. 2002. pp. 134–143.
Finch JA,Graham RW, et al. IRFPA ROIC with dual TDM reset integrators and sub-frame averaging functions per unit. US Patent No. 6885002. April 2005.
Johnson JF. Direct injection readout circuit model. In: Proceedings of SPIE. vol. 2226. 1994. pp. 120–129.
Liu F, Ding R, et al. 256 × 1 readout integrated circuit with simultaneous integration mode for two-color infrared detectors. In: Proceedings of SPIE. vol. 7158. 2009.
Mandl W, Kennedy J, Chu M. MOSAD IR focal plane per pixel A/D development. In: SPIE proceedings. vol. 2745. 1996. pp. 90–98.
Mandl W, Shen C, Martin P. Images and test results of MOSAD all digital 640 × 480 MWIR prototype camera. In: SPIE Proceedings, vol. 4131. 2000. pp. 355–363.
Mandl W. Four kiloframe, 14 bit, 128 × 128 digital imaging spectrometer. In: SPIE proceedings. vol. 4486. 2001. pp. 385–392.
Elkind S. Focal plane processor with a digital video output for InSb detectors. In: Proceedings of SPIE. vol. 4820, infrared technology and applications XXVIII. 2003. P751–P758.
Fillon P, Dugalleix S, Pistone F, Tribolet P. Digital output for high performance MCT staring arrays. In: Proceedings of the SPIE. vol. 6206. 2006. pp. 62060U.
Denyer PB, Renshaw D, Gouyu W, Ying LM. On-chip CMOS sensors for VLSI imaging systems. In VLSI 91, Edinburgh, UK, August 1991.
Dickinson A, Mendis S, Inglis D, Azadet K, Fossum ER. CMOS digital camera with parallel analog to digital conversion architecture. In Program of 1995 IEEE workshop on eeDs and advanced image sensors, Dana Point, CA, 20–22 April 1995.
Chen G, Shao Z, Chen J, et al. Design of CMOS integrated circuits. Xi’an: Xi’an Jiaotong University Press; 2000. P96–P101,P124–P126,P139–P156, .
Gan W,Ding R,Ni Y. Readout circuit with pixel level analog to digital conversion. Infrared components and their applications. In: SPIE, SPIE photonics Asia conference, China. vol. 5640. 2004.
Gan W, Ding R. Implementation of a readout circuit with pixel-level analog to digital conversion on IRFPA. In: Joint 31st international conference on infrared and millimeter waves and 14th international conference on terahertz electronics, Shanghai, China. 18–22 Sept 2006.
Fowler B, El Gamal A, Yang A. A CMOS area image sensor with pixel-level A/D conversion. ISSCC Digest of Technical Papers, San Francisco. 1994. pp. 226–227.
Yang D, Fowler B, El Gamal A. A nyquist-rate pixel-level ADC for CMOS image sensors. IEEE J Solid-State Circ. 1999;34(3):348–356.
Tchagaspanian M, Villard P,Dupont B. Design of ADC in 25um pixels pitch dedicated for IRFPA image processing at LETI.Infrared Technol Appl XXIII. 2007;6542:65421W1–65421W12.
Bisottoa S, de Borniola E, Mollard L, et al. A 25 μm pitch LWIR staring focal plane array with pixel-level 15-bit ADC ROIC achieving 2mK NETD. In: Proceedings of SPIE. vol. 7834. 2010. 78340J.
Liangchu Dong, Ruijun Ding, Zhengkai He. The study of the definition and measurement methods of characteristic parameters of IRFPA. Infrared Laser Eng. 1997;26(3):14–8.
Dong L, Ding R, Liang P. GB/T 17444 measuring methods for parameters of infrared focal plane arrays. Standards press of china; 1999 (Book number:155066.1–15431).
Dang Khoa V, Kauffman Christopher L, Derzko Zenon I. Infrared focal plane array crosstalk measurement. SPIE. 1992;1686:125–35.
Shao X. The development of a UV electrically calibrated detector and the study of calibration application. Dissertation, Jan 2009. Shanghai Institute of Technical Physics of The Chinese Academy of Sciences.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
Copyright information
© 2016 National Defense Industry Press, Beijing and Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
He, L., Yang, D., Ni, G. (2016). Readout Integrated Circuit, Measurement, and Testing Technology for Advanced Focal Plane Array. In: Technology for Advanced Focal Plane Arrays of HgCdTe and AlGaN. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-52718-4_7
Download citation
DOI: https://doi.org/10.1007/978-3-662-52718-4_7
Published:
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-52716-0
Online ISBN: 978-3-662-52718-4
eBook Packages: Physics and AstronomyPhysics and Astronomy (R0)