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Reaktives Ionentiefenätzen

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Literatur

  1. F. Lärmer, A. Schilp, Patentschrift DE 4241045, Verfahren zum anisotropen Ätzen von Silicium, Prioritätsdatum: 5. Dezember 1992.

    Google Scholar 

  2. F. Chollet, H. Liu, A (not so) short introduction to micro electromechanical systems, Version 3.0 2009). http://www.austincc.edu/jtiede/Files/Intro%20MEMS%20Book%20V2.pdf, Zugegriffen: 27. Mai 2016

    Google Scholar 

  3. O.A. Popov (Hrsg.), High density plasma sources: design, physics and performance (Noyes Publications, Park Ridge, 1995)

    Google Scholar 

  4. F. Lärmer, A. Urban, Challenges, developments and applications of silicon deep reactive ion etching. Microelectronic Engineering 67–68, 349–355 (2003)

    Article  Google Scholar 

  5. M. Offenberg, F. Lärmer, B. Elsner, H. Münzel, W. Riethmüller, Novel process for a monolithic integrated accelerometer Technical Digest of the 8th International Conference on Solid-State Sensors and Actuators, Stockholm, Schweden. 1995), S. 589–592

    Google Scholar 

  6. X. Li, T. Abe, M. Esashi, Deep reactive ion etching of pyrex glass using SF6 plasma. Sensors and Actuators A 87, 139–145 (2001)

    Article  Google Scholar 

  7. S. Wang, X. Li, K. Wakabayashi, M. Esashi, Deep reactive ion etching of lead zirconate titanate using sulfur hexafloride gas. Journal of the American Ceramic Society 82, 1339–1341 (1999)

    Article  Google Scholar 

  8. C. Zhang, C. Yang, D. Ding, Deep reactive ion etching of commercial PMMA in O2/CHF3, and O2/Ar-based discharges. Journal of Micromechanics and Microengineering 14, 663–666 (2004)

    Article  Google Scholar 

  9. S. Büttgenbach, A. Burisch, J. Hesselbach (Hrsg.), Design and manufacturing of active microsystems (Springer, Heidelberg, 2011)

    Google Scholar 

  10. A. Phataralaoha, R. Bandorf, G. Bräuer, S. Büttgenbach, Friction behavior in microsystems, in Design and manufacturing of active microsystems, ed. by S. Büttgenbach, A. Burisch, J. Hesselbach (Springer, Heidelberg, 2011), S. 89–108

    Chapter  Google Scholar 

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Büttgenbach, S. (2016). Reaktives Ionentiefenätzen. In: Mikrosystemtechnik. Technik im Fokus. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-49773-9_7

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