Mitigation Techniques Against TSV-to-TSV Coupling in 3DIC

  • Quan DengEmail author
  • Minxuan Zhang
  • Zhenyu Zhao
  • Peng Li
Conference paper
Part of the Communications in Computer and Information Science book series (CCIS, volume 592)


TSV in 3DIC introduces a large and fickle parasitic capacitance inevitably, causing serious problems on Power/Signal Integrity (P/SI). In this paper, we give two methods to mitigate TSV-to-TSV coupling, which are buffer insertion and shield insertion. The effect of the buffer insertion and shield insertion are studied by comparison experiment, and the experiment results have proved that these two methods can reduce the coupling capacitance effectively. Factors as location, number and drive capability of buffers in this course are also discussed. TSV-to-TSV coupling reduces by 99 % at maximum. Through combining the two method, we can get a low cost and effective optimization for reduction of TSV-to-TSV coupling in consideration of actual design restrain, which can also be utilized in EDA tools.


3DIC TSV-to-TSV coupling Shield insertion Buffer insertion 


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Copyright information

© Springer-Verlag Berlin Heidelberg 2016

Authors and Affiliations

  • Quan Deng
    • 1
    Email author
  • Minxuan Zhang
    • 1
  • Zhenyu Zhao
    • 1
  • Peng Li
    • 1
  1. 1.School of Computer ScienceNational University of Defense TechnologyChangshaChina

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