Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces pp 141-143 | Cite as
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Abstract
The mechanical properties of the solder joints in the circuit are important factors deciding the reliability of the electronic device. In this dissertation, a series of experimental schemes were designed according to the structure of the Pb-free solder joints and the loadings applied on them; the damage behavior of the solder joints at different loadings were comprehensively revealed, in order to provide some useful suggestion for reliability evaluation of the Pb-free solder joints. Based on the experimental results and discussions, the following conclusions are drawn.
Keywords
Fatigue Crack Fatigue Life Crack Initiation Solder Joint Thermal Fatigue
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© Springer-Verlag Berlin Heidelberg 2016