• Qingke ZhangEmail author
Part of the Springer Theses book series (Springer Theses)


The mechanical properties of the solder joints in the circuit are important factors deciding the reliability of the electronic device. In this dissertation, a series of experimental schemes were designed according to the structure of the Pb-free solder joints and the loadings applied on them; the damage behavior of the solder joints at different loadings were comprehensively revealed, in order to provide some useful suggestion for reliability evaluation of the Pb-free solder joints. Based on the experimental results and discussions, the following conclusions are drawn.


Fatigue Crack Fatigue Life Crack Initiation Solder Joint Thermal Fatigue 
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Copyright information

© Springer-Verlag Berlin Heidelberg 2016

Authors and Affiliations

  1. 1.Institute of Metal ResearchChinese Academy of SciencesShenyangChina
  2. 2.Zhengzhou Research Institute of Mechanical EngineeringZhengzhouChina

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