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Shear Creep-Fatigue Behavior of Cu/Pb-Free Solder Joints

  • Qingke ZhangEmail author
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Part of the Springer Theses book series (Springer Theses)

Abstract

The creep fatigue behavior of Sn–Ag/Cu and Sn–Bi/Cu solder joints was investigated in this chapter. The creep fatigue processes of the lead-free solder joints usually consist of a strain hardening stage, a steady deformation stage, and an accelerating fracture stage. For the Sn–4Ag/Cu solder joints, the strain increases rapidly during the initial few cycles, until strain hardening reaches a saturated state. After that the strain increases linearly with increasing cycles, deformation of the solder keeps developing, strain concentration occurs around the solder/Cu6Sn5 interface and generates initial microcracks. When the microcracks evolve into long cracks, the creep fatigue failure is accelerated and the solder joints fracture along the joint interface after a few more cycles. Grain subdivision occurs in the solder when the plastic strain reaches a certain threshold, then grain rotation and subdivision on a finer scale take place to accommodate further straining. The Sn–58Bi/Cu solder joints have three similar stages, only the strain increases exponentially with increasing cycles, and final fracture occurs in the solder. The major deformation mechanism of the SnBi solder is grain-boundary sliding, plastic deformation concentrates at the grain boundary, while the deformation inside the solder grain is little.

Keywords

Solder Joint Solder Alloy Deformation Band Joint Interface Dislocation Climb 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag Berlin Heidelberg 2016

Authors and Affiliations

  1. 1.Institute of Metal ResearchChinese Academy of SciencesShenyangChina
  2. 2.Zhengzhou Research Institute of Mechanical EngineeringZhengzhouChina

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