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Shear Creep-Fatigue Behavior of Cu/Pb-Free Solder Joints

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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

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Abstract

The creep fatigue behavior of Sn–Ag/Cu and Sn–Bi/Cu solder joints was investigated in this chapter. The creep fatigue processes of the lead-free solder joints usually consist of a strain hardening stage, a steady deformation stage, and an accelerating fracture stage. For the Sn–4Ag/Cu solder joints, the strain increases rapidly during the initial few cycles, until strain hardening reaches a saturated state. After that the strain increases linearly with increasing cycles, deformation of the solder keeps developing, strain concentration occurs around the solder/Cu6Sn5 interface and generates initial microcracks. When the microcracks evolve into long cracks, the creep fatigue failure is accelerated and the solder joints fracture along the joint interface after a few more cycles. Grain subdivision occurs in the solder when the plastic strain reaches a certain threshold, then grain rotation and subdivision on a finer scale take place to accommodate further straining. The Sn–58Bi/Cu solder joints have three similar stages, only the strain increases exponentially with increasing cycles, and final fracture occurs in the solder. The major deformation mechanism of the SnBi solder is grain-boundary sliding, plastic deformation concentrates at the grain boundary, while the deformation inside the solder grain is little.

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Authors and Affiliations

  1. Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China

    Qingke Zhang

  2. Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou, China

    Qingke Zhang

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Correspondence to Qingke Zhang .

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Zhang, Q. (2016). Shear Creep-Fatigue Behavior of Cu/Pb-Free Solder Joints. In: Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces. Springer Theses. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-48823-2_4

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  • DOI: https://doi.org/10.1007/978-3-662-48823-2_4

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-662-48821-8

  • Online ISBN: 978-3-662-48823-2

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