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Tensile-Compress Fatigue Behavior of Solder Joints

  • Qingke ZhangEmail author
Chapter
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Part of the Springer Theses book series (Springer Theses)

Abstract

Tensile-compress fatigue behavior of solder joints were studied in this chapter. The results reveal that under cyclic tension-compression loadings, fatigue lives of the solder joints decrease exponentially with increasing stress amplitude, and the lead-free solder joints have higher lives than the Sn–37Pb/Cu solder joints. Due to the deformation incompatibility, there is strain localization at the solder/Cu interface, fatigue cracks initiate along the solder/Cu interface, then propagate inside the solder around the joint interface or along the interface. The mechanical properties of solder play important roles in the fatigue lives by influencing the crack initiation and propagation path, while the interfacial microstructure determines the cycles of crack propagation by dominating the final fracture.

Keywords

Fatigue Crack Fatigue Life Solder Joint Solder Alloy Stress Amplitude 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag Berlin Heidelberg 2016

Authors and Affiliations

  1. 1.Institute of Metal ResearchChinese Academy of SciencesShenyangChina
  2. 2.Zhengzhou Research Institute of Mechanical EngineeringZhengzhouChina

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