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Research Progress in Pb-Free Soldering

  • Qingke ZhangEmail author
Chapter
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Part of the Springer Theses book series (Springer Theses)

Abstract

In this chapter, the research background and progress on Pb-free soldering are reviewed. Soldering is the most widely joining technology in microelectronic package, and Pb-free solders were proposed to replace the Sn–Pb solder out of environmental considerations. Thus far, many series of Pb-free solder have been proposed, their interfacial reaction behavior with common substrates and properties of the solder joints were studied, while the damage mechanisms have not been comprehensively revealed. For this reason, in this study a series of experiments were designed to reveal the damage behavior of the solder joints under different loadings.

Keywords

Solder Joint Creep Behavior Creep Deformation Eutectic Structure Joint Interface 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

References

  1. 1.
    Greig WJ. Integrated circuit packaging, assembly and interconnections (Springer series in advanced microelectronics). New York: Springer; 2007.Google Scholar
  2. 2.
    Laurila T, Vuorinen V, Kivilahti JK. Interfacial reactions between lead-free solders and common base materials. Mater Sci Eng R. 2005;49:1–60.CrossRefGoogle Scholar
  3. 3.
    Tu KN. Solder joint technology: materials, properties, and reliability. New York: Springer; 2007. p. 386.Google Scholar
  4. 4.
    Abtew M, Selvaduray G. Lead-free solders in microelectronics. Mater Sci Eng R. 2000;27:95–141.CrossRefGoogle Scholar
  5. 5.
    Zeng K, Tu KN. Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater Sci Eng R. 2002;38:55–105.CrossRefGoogle Scholar
  6. 6.
    Massalski TB, Okamoto H. Binary alloy phase diagrams. 2nd ed. New York: ASM International; 1990.Google Scholar
  7. 7.
    McCormack M, Jin S, Kammlott GW, Chen HS. New Pb-free solder alloy with superior mechanical properties. Appl Phys Lett. 1993;63:15–7.CrossRefGoogle Scholar
  8. 8.
    Ventura T, Terzi S, Rappaz M, Dahle AK. Effects of solidification kinetics on microstructure formation in binary Sn–Cu solder alloys. Acta Mater. 2011;59:1651–8.CrossRefGoogle Scholar
  9. 9.
    Grossmann G, Tharian J, Jud P, Sennhauser U. Microstructural investigation of lead-free BGAs soldered with tin-lead solder. Solder Surf Mt Technol. 2005;17:10–21.CrossRefGoogle Scholar
  10. 10.
    Loomans ME, Fine ME. Tin-silver-copper eutectic temperature and composition. Metall Mater Trans A. 2000;31:1155–62.CrossRefGoogle Scholar
  11. 11.
    Moon KW, Boettinger WJ, Kattner UR, Biancaniello FS, Handwerker CA. Experimental and thermodynamic assessment of Sn–Ag–Cu solder alloys. J Electron Mater. 2000;29:1122–36.CrossRefGoogle Scholar
  12. 12.
    Mei Z, Morris JW Jr. Characterization of eutectic Sn–Bi solder joints. J Electron Mater. 1992;21:599–607.CrossRefGoogle Scholar
  13. 13.
    Glazer J. Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: a review. J Electron Mater. 1994;23:693–700.CrossRefGoogle Scholar
  14. 14.
    Liu PL, Shang JK. Interfacial embrittlement by bismuth segregation in copper/tin–bismuth Pb-free solder interconnect. J Mater Res. 2001;16:1651–9.CrossRefGoogle Scholar
  15. 15.
    Lin HJ, Chuang TH. Intermetallic reactions in reflowed and aged Sn–9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads. J Electron Mater. 2006;35:154–64.CrossRefGoogle Scholar
  16. 16.
    Laurila T, Vuorinen V, Paulasto-Kröckel M. Impurity and alloying effects on interfacial reaction layers in Pb-free soldering. Mater Sci Eng R. 2010;68:1–38.CrossRefGoogle Scholar
  17. 17.
    Kang JS, Gagliano RA, Ghosh G, Fine ME. Isothermal solidification of Cu/Sn diffusion couples to form thin-solder joints. J Electron Mater. 2002;31:1238–43.CrossRefGoogle Scholar
  18. 18.
    Larsson AK, Stenberg L, Lidin S. The superstructure of domain-twinned eta’-Cu6Sn5. Acta Crystallogr B. 1994;50:636–43.CrossRefGoogle Scholar
  19. 19.
    Larsson AK, Stenberg L, Lidin S. Crystal-structure modulations in eta-Cu5Sn4. Z Kristallogr. 1995;210:832–7.Google Scholar
  20. 20.
    Gao F, Nishikawa H, Takemoto T. Intermetallics evolution in Sn–3.5Ag based lead-free solder matrix on an OSPCu finish. J Electron Mater. 2007;36:1630–4.CrossRefGoogle Scholar
  21. 21.
    Yoon JW, Lim JH, Lee HJ, Joo J, Jung SB, Moon WC. Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C. J Mater Res. 2006;21:3196–204.CrossRefGoogle Scholar
  22. 22.
    Tseng HW, Liu CY. Evolution of Ag3Sn compound formation in Ni/Sn5Ag/Cu solder joint. Mater Lett. 2008;62:3887–9.CrossRefGoogle Scholar
  23. 23.
    Song JM, Lin JJ, Huang CF, Chuang HY. Crystallization, morphology and distribution of Ag3Sn in Sn–Ag–Cu alloys and their influence on the vibration fracture properties. Mater Sci Eng A. 2007;466:9–17.CrossRefGoogle Scholar
  24. 24.
    Henderson DW, Gosselin T, Sarkhel A, Kang SK, Choi WK, Shih DY, Goldsmith C, Puttlitz KJ. Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys. J Mater Res. 2002;17:2775–8.CrossRefGoogle Scholar
  25. 25.
    Zou HF, Yang HJ, Tan J, Zhang ZF. Preferential growth and orientation relationship of Ag3Sn grains formed between molten Sn and (001) Ag single crystal. J Mater Res. 2009;24:2141–4.CrossRefGoogle Scholar
  26. 26.
    Gur D, Bamberger M. Reactive isothermal solidification in the Ni–Sn system. Acta Mater. 1998;46:4917–23.CrossRefGoogle Scholar
  27. 27.
    Ghosh G. Interfacial microstructure and the kinetics of interfacial reaction in diffusion couples between Sn–Pb solder and Cu/Ni/Pd metallization. Acta Mater. 2000;48:3719–38.CrossRefGoogle Scholar
  28. 28.
    Görlich J, Baither D, Schmitz G. Reaction kinetics of Ni/Sn soldering reaction. Acta Mater. 2010;58:3187–97.CrossRefGoogle Scholar
  29. 29.
    Li JF, Mannan SH, Clode MP, Chen K, Whalley DC, Liu C, Hutt DA. Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders. Acta Mater. 2007;55:737–52.CrossRefGoogle Scholar
  30. 30.
    Bader S, Gust W, Hieber H. Rapid formation of intermetallic compounds by interdiffusion in the Cu–Sn and Ni–Sn systems. Acta Metall Mater. 1995;43:329–37.Google Scholar
  31. 31.
    Dybkov VI. Effect of dissolution on the Ni3Sn4 growth kinetics at the interface of Ni and liquid Sn-base solders. Solid State Phenom. 2008;138:153–8.CrossRefGoogle Scholar
  32. 32.
    Chan YC, Yang D. Failure mechanisms of solder interconnects under current stressing in advanced electronic packages. Prog Mater Sci. 2010;55:428–75.CrossRefGoogle Scholar
  33. 33.
    Evans JW. A guide to lead-free solders. 1st ed. London: Springer; 2005.Google Scholar
  34. 34.
    Ohguchi KI, Sasaki K, Ishibashi M. A quantitative evaluation of time-independent and time-dependent deformations of lead-free and lead-containing solder alloys. J Electron Mater. 2006;35:132–9.CrossRefGoogle Scholar
  35. 35.
    Park S, Dhakal R, Lehman L, Cotts E. Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading. Acta Mater. 2007;55:3253–60.CrossRefGoogle Scholar
  36. 36.
    Frear DR. The mechanical behavior of interconnect materials for electronic packaging. J Mater. 1996;48:49–53.Google Scholar
  37. 37.
    Glazer J. Metallurgy of low temperature Pb-free solders for electronic assembly. Int Mater Rev. 1995;40:65–93.CrossRefGoogle Scholar
  38. 38.
    Thwaites CJ. Soft soldering handbook. International Tin Research Institute, Publication No. 533; 1977.Google Scholar
  39. 39.
    Yamagishi Y, Ochiai M, Ueda H, Nakanishi T, Kitazima M. Pb-free solder of Sn–58Bi improved with Ag. In: Proceedings of the 9th international microelectronics conference, Omiya, Japan. 1996. pp. 252–5.Google Scholar
  40. 40.
    Tojima K. Wetting characteristics of lead-free solders, senior project report. Materials Engineering Department, San Jose State University, May 1999.Google Scholar
  41. 41.
    Hua F, Glazer J. Lead-free solders for electronic assembly, design and reliability of solders and solder interconnections. In: Mahidhara RK, Frear DR, Sastry SML, Liaw KL, Winterbottom WL, editors. The minerals, metals and materials society. 1997. pp. 65–74.Google Scholar
  42. 42.
    Andersson C, Sun P, Liu JH. Tensile properties and microstructural characterization of Sn–0.7Cu–0.4Co bulk solder alloy for electronics applications. J Alloys Compd. 2008;457:97–105.CrossRefGoogle Scholar
  43. 43.
    Shohji I, Yoshida T, Takahashi T, Hioki S. Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity. Mater Sci Eng A. 2004;366:50–5.CrossRefGoogle Scholar
  44. 44.
    Fouassier O, Heintz JM, Chazelas J, Geffroy PM, Silvain JF. Microstructural evolution and mechanical properties of SnAgCu alloys. J Appl Phys. 2006;100:043519.CrossRefGoogle Scholar
  45. 45.
    Zhu FL, Zhang HH, Guan RF, Liu S. Effects of temperature and strain rate on mechanical property of Sn96.5Ag3Cu0.5. Microelectron Eng. 2007;84:144–50.CrossRefGoogle Scholar
  46. 46.
    Mavoori H, Chin J, Vayman S, Moran B, Keer L, Fine M. Creep, stress relaxation, and plastic deformation in Sn–Ag and Sn–Zn eutectic solders. J Electron Mater. 1997;26:783–90.CrossRefGoogle Scholar
  47. 47.
    Ochoa F, Willlams JJ, Chawla N. Effects of cooling rate on the microstructure and tensile behavior of a Sn–3.5wt.%Ag solder. J Electron Mater. 2003;32:1414–20.CrossRefGoogle Scholar
  48. 48.
    Schoeller H, Bansal S, Knobloch A, Shaddock D, Cho J. Microstructure evolution and the constitutive relations of high-temperature solders. J Electron Mater. 2009;38:802–9.CrossRefGoogle Scholar
  49. 49.
    ASM International. Electronic materials handbook, vol. 1. Packaging Materials Park, OH: ASM International; 1989. p. 640.Google Scholar
  50. 50.
    Solder alloy data: mechanical properties of solders and soldered joints. International Tin Research Institute, Uxbridge, England, p. 60.Google Scholar
  51. 51.
    Tomlinson WJ, Collier I. The mechanical properties and microstructures of copper and brass joints soldered with eutectic tin-bismuth solder. J Mater Sci. 1987;22:1835–9.CrossRefGoogle Scholar
  52. 52.
    Artaki I, Jackson AM, Vianco PT. Evaluation of lead-free joints in electronic assemblies. J Electron Mater. 1994;23:757–64.CrossRefGoogle Scholar
  53. 53.
    Ma HT. Constitutive models of creep for lead-free solders. J Mater Sci. 2009;44:3841–51.CrossRefGoogle Scholar
  54. 54.
    Morris JW Jr, Goldstein JLF, Mei Z. Microstructure and mechanical properties of Sn–In and Sn–Bi solders. J Electron Mater. 1993;22:25–7.CrossRefGoogle Scholar
  55. 55.
    Mukherjee AK, Bird JE, Dorn JE. Experimental correlations for high-temperature creep. Trans Am Soc Met. 1969;62:155–79.Google Scholar
  56. 56.
    Hertzberg RW. Deformation and fracture mechanics of engineering materials. 4th ed. New York: Wiley; 1996.Google Scholar
  57. 57.
    Chen ZG, Shi YW. Xia ZD. Constitutive relations on creep for SnAgCuRE lead-free solder joints. 2004;33:964–71.Google Scholar
  58. 58.
    Zhang KK, Lwang Y, Fan YL, Zhang X. Research on creep properties of Sn2.5Ag0.7CuXRE lead-free soldered joints for surface mount technology. Mater Sci. 2007;353–358:2912–5.Google Scholar
  59. 59.
    Ma HT, Suhling JC. A review of mechanical properties of lead-free solders for electronic packaging. J Mater Sci. 2009;44:1141–58.CrossRefGoogle Scholar
  60. 60.
    Yan YF, Ji LQ, Zhang KK, Yan HX, Feng LF. Foundation of steady state creep constitutive equation of SnCu soldered joints. Trans China Weld Inst. 2007;28(9):75–9.Google Scholar
  61. 61.
    Igoshev VI, Kleiman JI. Creep phenomena in lead-free solders. J Electron Mater. 2000;29:244–50.CrossRefGoogle Scholar
  62. 62.
    Xiao Q, Armstrong WD. Tensile creep and microstructural characterization of bulk Sn3.9Ag0.6Cu lead-free solder. J Electron Mater. 2005;34:196–211.CrossRefGoogle Scholar
  63. 63.
    Wiese S, Schubert A, Walter H, Dudek R, Feustel F, Meusel E, Michel B. Constitutive behavior of lead-free solders vs. lead containing solders–experiments on bulk specimens and flip-chip joints. In: Proceeding of the 51st electronic components and technology conference, pp. 890–902.Google Scholar
  64. 64.
    Clech JP. Review and analysis of lead-free materials properties, NIST. Available at http://www.metallurgy.nist.gov/solder/clech/Sn-Ag-Cu_Main.htm.
  65. 65.
    Vianco PT. Fatigue and creep of lead-free solder alloys: fundamental properties. 1st edn. New York: ASM International; 2006.Google Scholar
  66. 66.
    Pang JHL, Xiong BS, Low TH. Creep and fatigue characterization of lead-free 95.5Sn–3.8Ag–0.7Cu solder. In: Proceeding of 54th electronic components and technology conference. 2004. pp. 1333–7.Google Scholar
  67. 67.
    Shi YW, Liu JP, Yan YF, Xia ZD, Lei YP, Guo F, Li XY. Creep properties of composite solders reinforced with nano- and microsized particles. J Electron Mater. 2008;37:507–17.CrossRefGoogle Scholar
  68. 68.
    Shi YW, Liu JP, Xia ZD, Lei YP, Guo F, Li XY. Creep property of composite solders reinforced by nano-sized particles. J Mater Sci: Mater Electron. 2008;19:349–56.Google Scholar
  69. 69.
    Guo F, Lee J, Lucas JP, Subramanian KN, Bieler TR. Creep properties of eutectic Sn–3.5Ag solder joints reinforced with mechanically incorporated Ni particles. J Electron Mater. 2001;30:1222–7.CrossRefGoogle Scholar
  70. 70.
    Tai F, Guo F, Liu JP, Xia ZD, Shi YW, Lei YP, Li XY. Creep properties of Sn–0.7Cu composite solder joints reinforced with nano-sized Ag particles. Solder Surf Mt Technol. 2010;22:50–6.Google Scholar
  71. 71.
    Nozaki M, Sakane M, Tsukada Y. Crack propagation behavior of Sn–3.5Ag solder in low cycle fatigue. Int J Fatigue. 2008;30:1729–36.CrossRefGoogle Scholar
  72. 72.
    Arfaei B, Cotts E. Correlations between the microstructure and fatigue life of near-eutectic Sn–Ag–Cu Pb-free solders. J Electron Mater. 2009;38:2617–27.CrossRefGoogle Scholar
  73. 73.
    Zhao J, Mutoh Y, Miyashita Y, Wang L. Fatigue crack growth behavior of Sn–Pb and Sn-based lead-free solders. Eng Fract Mech. 2003;70:2187–97.CrossRefGoogle Scholar
  74. 74.
    Kanchanomai C, Miyashita Y, Mutoh Y, Mannan SL. Influence of frequency on low cycle fatigue behavior of Pb-free solder 96.5Sn–3.5Ag. Mater Sci Eng A. 2003;345:90–8.Google Scholar
  75. 75.
    Kanchanomai C, Mutoh Y. Low-cycle fatigue prediction model for Pb-free solder 96.5Sn–3.5Ag. J Electron Mater. 2004;33:329–33.CrossRefGoogle Scholar
  76. 76.
    Pang JHL, Xiong BS, Low TH. Low cycle fatigue study of lead free 99.3Sn–0.7Cu solder alloy. Int J Fatigue. 2004;26:865–72.CrossRefGoogle Scholar
  77. 77.
    Pang JHL, Xiong BS, Low TH. Low cycle fatigue models for lead-free solders. Thin Solid Films. 2004;462–463:408–12.CrossRefGoogle Scholar
  78. 78.
    Shang JK, Zeng QL, Zhang L, Zhu QS. Mechanical fatigue of Sn-rich Pb-free solder alloys. J Mater Sci: Mater Electron. 2007;18:211–27.Google Scholar
  79. 79.
    Takemoto T, Matsunawa A, Takahashi M. Tensile test for estimation of thermal fatigue properties of solder alloys. J Mater Sci. 1997;32:4077–84.CrossRefGoogle Scholar
  80. 80.
    Lea C. A scientific guide to surface mount technology. GB-Port Erin, British Isles: Electrochemical Publications Ltd; 1988.Google Scholar
  81. 81.
    Kikuchi S, Nishimura M, Suetsugu K, Ikari T, Matsushige K. Strength of bonding interface in lead-free Sn alloy solders. Mater Sci Eng A. 2001;319–321:475–9.CrossRefGoogle Scholar
  82. 82.
    Lee HT, Chen MH, Jao HM, Liao TL. Influence of interfacial intermetallic compound on fracture behavior of solder joints. Mater Sci Eng A. 2003;358:134–41.CrossRefGoogle Scholar
  83. 83.
    Lee HT, Lee YH. Adhesive strength and tensile fracture of Ni particle enhanced Sn–Ag composite solder joints. Mater Sci Eng A. 2006;419:172–80.CrossRefGoogle Scholar
  84. 84.
    Zou HF, Zhu QS, Zhang ZF. Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint. J Alloy Compd. 2008;461:410–7.CrossRefGoogle Scholar
  85. 85.
    Dao M, Chollacoop N, Van Vliet KJ, Venkatesh TA, Suresh S. Computational modeling of the forward and reverse problems in instrumented sharp indentation. Acta Mater. 2001;49:3899–918.CrossRefGoogle Scholar
  86. 86.
    Deng X, Chawla N, Chawla KK, Koopman M. Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation. Acta Mater. 2004;52:4291–303.CrossRefGoogle Scholar
  87. 87.
    Deng X, Sidhu RS, Johnson P, Chawla N. Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn–3.5Ag solder/Cu joints. Metall Mater Trans A. 2005;36A:55–64.Google Scholar
  88. 88.
    Kima KS, Huh SH, Suganuma K. Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints. J Alloys Compd. 2003;352:226–36.CrossRefGoogle Scholar
  89. 89.
    Yoon JW, Kim SW, Jung SB. Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging. J Alloys Compd. 2005;391:82–9.CrossRefGoogle Scholar
  90. 90.
    Choi WK, Kim JH, Jeong SW, Lee HM. Interfacial microstructure and joint strength of Sn–3.5Ag-X (X = Cu, In, Ni) solder joint. J Mater Res. 2002;17:43–51.CrossRefGoogle Scholar
  91. 91.
    Kim SW, Yoon JW, Jung SB. Interfacial reactions and shear strengths between Sn–Ag-based Pb-free solder balls and Au/EN/Cu metallization. J Electron Mater. 2004;33:1182–9.CrossRefGoogle Scholar
  92. 92.
    Ahat S, Sheng M, Le L. Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging. J Electron Mater. 2001;30:1317–22.CrossRefGoogle Scholar
  93. 93.
    Lee YH, Lee HT. Shear strength and interfacial microstructure of Sn–Ag–xNi/Cu single shear lap solder joints. Mater Sci Eng A. 2007;444:75–83.CrossRefGoogle Scholar
  94. 94.
    Anderson IE, Harringa JL. Elevated temperature aging of solder joints based on Sn–Ag–Cu: effects on joint microstructure and shear strength. J Electron Mater. 2004;33:1485–96.CrossRefGoogle Scholar
  95. 95.
    Zou HF, Zhang ZF. Ductile-to-brittle transition induced by increasing strain rate in Sn–3Cu/Cu joints. J Mater Res. 2008;23:1614–7.CrossRefGoogle Scholar
  96. 96.
    Fields RJ, Low SR. Physical and mechanical properties of intermetallic compounds commonly found in solder joints. Metallurgy Division of National Institute of Standards and Technology (NIST), USA, Technical paper, 2001.Google Scholar
  97. 97.
    Frear DR, Burchett SN, Morgan HS, Lau JH. The mechanics of solder alloy interconnects. 1st ed. New York: Springer; 1994.Google Scholar
  98. 98.
    Wang ZX, Dutta I, Majumdara BS. Thermal cycle response of a lead-free solder reinforced with adaptive shape memory alloy. Mater Sci Eng A. 2006;421:133–42.CrossRefGoogle Scholar
  99. 99.
    Towashiraporn P, Gall K, Subbarayan G, McIlvanie B, Hunter BC, Love D, Sullivan B. Power cycling thermal fatigue of Sn–Pb solder joints on a chip scale package. Inter J Fatigue. 2004;26:497–510.CrossRefGoogle Scholar
  100. 100.
    Guo HY, Guo JD, Shang JK. Influence of thermal cycling on the thermal resistance of solder interfaces. J Electron Mater. 2009;38:2470–8.CrossRefGoogle Scholar
  101. 101.
    Kobayashi T, Lee A, Subramanian KN. Impact behavior of thermomechanically fatigued Sn-based solder joints. J Electron Mater. 2009;38:2659–67.CrossRefGoogle Scholar
  102. 102.
    Seah SKW, Wonga EH, Shim VPW. Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading. Script Mater. 2008;59:1239–42.CrossRefGoogle Scholar
  103. 103.
    Lehman LP, Xing Y, Bieler TR, Cotts EJ. Cyclic twin nucleation in tin-based solder alloys. Acta Mater. 2010;58:3546–56.CrossRefGoogle Scholar
  104. 104.
    Lee KO, Yu J, Park TS, Lee SB. Low-cycle fatigue characteristics of Sn-based solder joints. J Electron Mater. 2004;33:249–57.CrossRefGoogle Scholar
  105. 105.
    Sundelin JJ, Nurmib ST, Lepistö TK. Recrystallization behaviour of SnAgCu solder joints. Mater Sci Eng A. 2008;474:201–7.CrossRefGoogle Scholar
  106. 106.
    Erinc M, Assman TM, Schreurs PJG, Geers MGD. Fatigue fracture of SnAgCu solder joints by microstructural modeling. Int J Fract. 2008;152:37–49.CrossRefGoogle Scholar
  107. 107.
    Mei Z, Morris JWJR. Superplastic creep of low melting point solder joints. J Electron Mater. 1992;21:401–7.CrossRefGoogle Scholar
  108. 108.
    Kerr M, Chawla N. Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales. Acta Mater. 2004;52:4527–35.CrossRefGoogle Scholar
  109. 109.
    Telang AU, Bieler TR. The orientation imaging microscopy of lead-free Sn–Ag solder joints. JOM. 2005: 44–9.Google Scholar

Copyright information

© Springer-Verlag Berlin Heidelberg 2016

Authors and Affiliations

  1. 1.Institute of Metal ResearchChinese Academy of SciencesShenyangChina
  2. 2.Zhengzhou Research Institute of Mechanical EngineeringZhengzhouChina

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