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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces pp 1–33Cite as

Research Progress in Pb-Free Soldering

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Abstract

In this chapter, the research background and progress on Pb-free soldering are reviewed. Soldering is the most widely joining technology in microelectronic package, and Pb-free solders were proposed to replace the Sn–Pb solder out of environmental considerations. Thus far, many series of Pb-free solder have been proposed, their interfacial reaction behavior with common substrates and properties of the solder joints were studied, while the damage mechanisms have not been comprehensively revealed. For this reason, in this study a series of experiments were designed to reveal the damage behavior of the solder joints under different loadings.

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  1. Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China

    Qingke Zhang

  2. Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou, China

    Qingke Zhang

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Zhang, Q. (2016). Research Progress in Pb-Free Soldering. In: Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces. Springer Theses. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-48823-2_1

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