Research Progress in Pb-Free Soldering

  • Qingke ZhangEmail author
Part of the Springer Theses book series (Springer Theses)


In this chapter, the research background and progress on Pb-free soldering are reviewed. Soldering is the most widely joining technology in microelectronic package, and Pb-free solders were proposed to replace the Sn–Pb solder out of environmental considerations. Thus far, many series of Pb-free solder have been proposed, their interfacial reaction behavior with common substrates and properties of the solder joints were studied, while the damage mechanisms have not been comprehensively revealed. For this reason, in this study a series of experiments were designed to reveal the damage behavior of the solder joints under different loadings.


Solder Joint Creep Behavior Creep Deformation Eutectic Structure Joint Interface 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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Copyright information

© Springer-Verlag Berlin Heidelberg 2016

Authors and Affiliations

  1. 1.Institute of Metal ResearchChinese Academy of SciencesShenyangChina
  2. 2.Zhengzhou Research Institute of Mechanical EngineeringZhengzhouChina

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