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Technology Developments of Micro Fluid Dispensing

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Proceedings of the 2015 Chinese Intelligent Systems Conference

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE))

Abstract

Micro fluid dispensing technology is widely applied in electronics packaging, micro electromechanical system assembly, and biotechnology experiments, in which pl or nl amount of fluid materials (such as solder paste, adhesive, and DNA solution) are delivered controllably for the purpose of conducting, bonding, sealing, etc. This paper reviewed the latest developments as well as advantages and limits of three kinds of micro dispensing technology, which are needle nozzle type, integrated nozzle type and pin transfer type, classified according to the configuration of the nozzle unit. The measuring methods for the micro droplets are also briefly introduced in the article. Our work of dispensing less than 3 pl adhesive in an microassembly task is briefly introduced, and the trends and challenges of micro fluid dispensing are also discussed.

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Acknowledgments

This work is supported by National Natural Science Foundation of China (Grant NO.61175111).

Author information

Authors and Affiliations

  1. School of Information Engineering, Yangzhou University, Jiangsu, 225127, China

    Fudong Li, Tianping Zhang & Yuequan Yang

  2. Research Center of Precision Sensing and Control, Institute of Automation Chinese Academy of Sciences, Beijing, China

    De Xu

Authors
  1. Fudong Li
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  2. De Xu
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  3. Tianping Zhang
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  4. Yuequan Yang
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Corresponding author

Correspondence to Fudong Li .

Editor information

Editors and Affiliations

  1. Beihang University, Beijing, China

    Yingmin Jia

  2. Beijing University of Posts and Telecommunications, Beijing, China

    Junping Du

  3. Tsinghua University, Beijing, China

    Hongbo Li

  4. University of Science & Technology Beijing, Beijing, China

    Weicun Zhang

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Li, F., Xu, D., Zhang, T., Yang, Y. (2016). Technology Developments of Micro Fluid Dispensing. In: Jia, Y., Du, J., Li, H., Zhang, W. (eds) Proceedings of the 2015 Chinese Intelligent Systems Conference. Lecture Notes in Electrical Engineering. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-48365-7_18

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  • DOI: https://doi.org/10.1007/978-3-662-48365-7_18

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  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-662-48363-3

  • Online ISBN: 978-3-662-48365-7

  • eBook Packages: EngineeringEngineering (R0)

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