Emerging Assembly Technology for Automotive Applications

  • Katrin Heinricht
  • Joachim Kloeser
  • Kai Kutzner
  • Liane Lauter
  • Rolf Aschenbrenner
  • Herbert Reichl

Abstract

Emerging assembly technology include both flip chip and chip scale packaging. Both of them provide excellent capabilities to fulfill the needs of today’s and tomorrow’s requirements in automotive applications. These products must withstand high temperature, vibrations, wear and abuse.

Keywords

Nickel Furnace Production Line Upscaling 

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Copyright information

© Springer-Verlag Berlin Heidelberg 1998

Authors and Affiliations

  • Katrin Heinricht
    • 1
  • Joachim Kloeser
    • 1
  • Kai Kutzner
    • 1
  • Liane Lauter
    • 1
  • Rolf Aschenbrenner
    • 1
  • Herbert Reichl
    • 1
  1. 1.Dept. Chip Interconnection Technologies and Advanced PackagesFraunhofer Institute FhG/IZM-BerlinBerlinGermany

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