Advertisement

Emerging Assembly Technology for Automotive Applications

  • Katrin Heinricht
  • Joachim Kloeser
  • Kai Kutzner
  • Liane Lauter
  • Rolf Aschenbrenner
  • Herbert Reichl

Abstract

Emerging assembly technology include both flip chip and chip scale packaging. Both of them provide excellent capabilities to fulfill the needs of today’s and tomorrow’s requirements in automotive applications. These products must withstand high temperature, vibrations, wear and abuse.

Keywords

Solder Ball Automotive Application Electroless Nickel Flip Chip Fraunhofer Institute 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Copyright information

© Springer-Verlag Berlin Heidelberg 1998

Authors and Affiliations

  • Katrin Heinricht
    • 1
  • Joachim Kloeser
    • 1
  • Kai Kutzner
    • 1
  • Liane Lauter
    • 1
  • Rolf Aschenbrenner
    • 1
  • Herbert Reichl
    • 1
  1. 1.Dept. Chip Interconnection Technologies and Advanced PackagesFraunhofer Institute FhG/IZM-BerlinBerlinGermany

Personalised recommendations