Microelectronic Technologies for Automotives

Abstract

Microelectronic modules for the automotive industry have to adhere to stringent requirements in terms of resistance to various climatic conditions. This results in certain conditions that have to be met by the packaging and interconnection technology as an important interdisciplinary part of the microsystems. To fulfill the ever more stringent quality requirements, the trend is towards modules linked up in networks. The demand for higher reliability, functionality, performance, and miniaturization with a concurrent reduction in costs requires a new type of integration, which can be achieved by the combination of mechanical and electronic components into one unit. At the same time there is an integration of electronics, actuators, sensors, switches and controllers into sub-systems, which are connected to control units for engines, transmission, brakes, etc. These trends have important implications for the packaging and interconnection technologies for microelectronic modules for automotive applications. Thick-film or hybrid circuit consist of screen printed layers of conductive, dielectric, or resistive materials on an alumina substrate. These layers are applied in form of an ink or paste, are subsequently dried and sintered at high temperatures, where they form a strong bond with the alumina substrate. Thus a double-sided substrate with multilayers and integrated resistors is obtained, to which housed components can be soldered and naked dice can be bonded.