Abstract
Chip-on-board (COB) technology involves attaching a semiconductor die directly to a PCB substrate with adhesive, wire bonding it to a circuit pattern already present on the board, and then encapsulating it. Chip-on-board is surface-mount technology (SMT) taken to its extreme, the difference between COB and SMT essentially being that COB usually involves high lead count, active devices and dispenses with the ceramic or molded plastic outer device packaging.
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© 1985 Springer-Verlag Berlin Heidelberg
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Keeler, R. (1985). Chip-on-board Technology. In: Riley, F. (eds) The Electronics Assembly Handbook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_9
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DOI: https://doi.org/10.1007/978-3-662-13161-9_9
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-13163-3
Online ISBN: 978-3-662-13161-9
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