Abstract
Five years ago, the concept of automated inspection of electronic device leads was just that — a concept. Even a few years ago, scanning for bent or missing leads on dual in-line packages (DIPs) was considered a luxury in the electronics assembly process. Today however, with the explosive growth in markets for electronics products and the aggressive quest for perfect automation equipment to produce these products, lead scanning has become a necessity.
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© 1985 Springer-Verlag Berlin Heidelberg
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Penn, E.J. (1985). Lead Scanning. In: Riley, F. (eds) The Electronics Assembly Handbook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_61
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DOI: https://doi.org/10.1007/978-3-662-13161-9_61
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-13163-3
Online ISBN: 978-3-662-13161-9
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