Abstract
Much of what we term ‘high tech’ is really just an accretion of a lot of ‘low tech’. In the hot new technology of surface-mount devices (SMDs), an important role is being played by adhesives in holding parts securely to the substrate during handling and soldering operations.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 1988 Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
Keeler, R. (1988). Adhesives for SMD Wave Soldering. In: Riley, F. (eds) The Electronics Assembly Handbook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_47
Download citation
DOI: https://doi.org/10.1007/978-3-662-13161-9_47
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-13163-3
Online ISBN: 978-3-662-13161-9
eBook Packages: Springer Book Archive