SMD Placement Using Machine Vision
VLSI allows designers to pack more circuitry onto their chips, but as chip complexity increases, so does the number of I/O lines needed to access that added complexity. To increase the number of terminations per device while maintaining the smallest mechanical package, vendors are reducing the lead spacing on surface-mount components from 0.050in. to 0.025in., and in some cases, even to 0.010in. As lead spacing shrinks, the requirements for accurate automatic devices placement become more stringent.
KeywordsMachine Vision Rotational Error Placement Machine Placement Process Assembly Machine
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