Abstract
VLSI allows designers to pack more circuitry onto their chips, but as chip complexity increases, so does the number of I/O lines needed to access that added complexity. To increase the number of terminations per device while maintaining the smallest mechanical package, vendors are reducing the lead spacing on surface-mount components from 0.050in. to 0.025in., and in some cases, even to 0.010in. As lead spacing shrinks, the requirements for accurate automatic devices placement become more stringent.
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© 1986 Springer-Verlag Berlin Heidelberg
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Field, J., Payne, J., Cullen, C. (1986). SMD Placement Using Machine Vision. In: Riley, F. (eds) The Electronics Assembly Handbook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_31
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DOI: https://doi.org/10.1007/978-3-662-13161-9_31
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-13163-3
Online ISBN: 978-3-662-13161-9
eBook Packages: Springer Book Archive