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SMD Placement Using Machine Vision

  • Jim Field
  • John Payne
  • Chris Cullen

Abstract

VLSI allows designers to pack more circuitry onto their chips, but as chip complexity increases, so does the number of I/O lines needed to access that added complexity. To increase the number of terminations per device while maintaining the smallest mechanical package, vendors are reducing the lead spacing on surface-mount components from 0.050in. to 0.025in., and in some cases, even to 0.010in. As lead spacing shrinks, the requirements for accurate automatic devices placement become more stringent.

Keywords

Machine Vision Rotational Error Placement Machine Placement Process Assembly Machine 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag Berlin Heidelberg 1986

Authors and Affiliations

  • Jim Field
    • 1
  • John Payne
    • 1
  • Chris Cullen
    • 1
  1. 1.Automatix Inc.USA

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