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Automated Placement Techniques

  • Nikita Andreiev

Abstract

Large-scale manufacturers of hybrids stand to gain from recent advances in pick-and-place machinery introduced by Philips of The Netherlands. Based on technology developed for automatic placement of SMDs (surface-mount devices) on PCBs, the new system, the MCM IV, features a software-controlled simultaneous or sequential placement mode of operation. Other notable features include a multipurpose placement head and mechanically pressing a component onto its footprint without damaging the substrate.

Keywords

Transport Module Machine Cycle Placement Mode Placement Position Placement Head 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer-Verlag Berlin Heidelberg 1985

Authors and Affiliations

  • Nikita Andreiev

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