Large-scale manufacturers of hybrids stand to gain from recent advances in pick-and-place machinery introduced by Philips of The Netherlands. Based on technology developed for automatic placement of SMDs (surface-mount devices) on PCBs, the new system, the MCM IV, features a software-controlled simultaneous or sequential placement mode of operation. Other notable features include a multipurpose placement head and mechanically pressing a component onto its footprint without damaging the substrate.
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