Abstract
A relatively new concept which appears to have a bright future in COB applications is known as tape automated bonding (TAB). This technique utilizes photoimaging/etching processes to produce fabricated conductors on a dielectric tape.
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© 1985 Springer-Verlag Berlin Heidelberg
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Ginsberg, G.L. (1985). Tab and Flip-Chip Technology. In: Riley, F. (eds) The Electronics Assembly Handbook. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-13161-9_11
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DOI: https://doi.org/10.1007/978-3-662-13161-9_11
Publisher Name: Springer, Berlin, Heidelberg
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