Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding

  • J. Haisma
Part of the Springer Series in MATERIALS SCIENCE book series (SSMATERIALS, volume 75)


Patents tell their own (hi)story, which is not always covered by scientific literature. They basically represent the moving front of the state of the art. Direct (glue-less) bonding, which occurs under ambient conditions, has a longer history (from the 19th century) than its patented counterpart (from the second quarter of the 20th century); fusion (wafer) bonding dates mainly from after World War II. Contact bonding covers all types of bonding, realized by the face-to-face contacting of two bodies under various conditions (e.g. vacuum) and after-treatments (e.g. annealing).


Filing Date Silicon Wafer Porous Silicon Priority Date Direct Bonding 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


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