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Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding

  • Chapter
Wafer Bonding

Part of the book series: Springer Series in MATERIALS SCIENCE ((SSMATERIALS,volume 75))

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Abstract

Patents tell their own (hi)story, which is not always covered by scientific literature. They basically represent the moving front of the state of the art. Direct (glue-less) bonding, which occurs under ambient conditions, has a longer history (from the 19th century) than its patented counterpart (from the second quarter of the 20th century); fusion (wafer) bonding dates mainly from after World War II. Contact bonding covers all types of bonding, realized by the face-to-face contacting of two bodies under various conditions (e.g. vacuum) and after-treatments (e.g. annealing).

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  1. J. Haisma
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  1. Max-Planck Institute of Microstructure Physics, Weinberg 2, 06120, Halle (Saale), Germany

    Marin Alexe  & Ulrich Gösele  & 

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© 2004 Springer-Verlag Berlin Heidelberg

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Haisma, J. (2004). Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding. In: Alexe, M., Gösele, U. (eds) Wafer Bonding. Springer Series in MATERIALS SCIENCE, vol 75. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-10827-7_1

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  • DOI: https://doi.org/10.1007/978-3-662-10827-7_1

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-05915-5

  • Online ISBN: 978-3-662-10827-7

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