Abstract
In comparison to the solid-vacuum interface, i.e. the clean, well-defined surface of a solid, other solid interfaces are of much more practical importance. The solid-liquid interface, for example, plays a major role in electrochemistry and biophysics. Studies of that particular interface have a long tradition in physical chemistry. A detailed treatment of solid-liquid interfaces is far beyond the scope of this text although certain general concepts, e.g. that of space-charge layers, are similar to those of the solid-vacuum and solid-solid interface.
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References
S.M. Sze: Physics of Semiconductor Devices ( Wiley, New York 1981 )
L.J. Brillson: The structure and properties of metal-semiconductor interfaces, Surf. Sci. Rep. 2, 123 (1982)
H.A. Bethe: Theory of the boundary layer of crystal rectifiers, MIT Radiat. Lab. Rep. 43–12 (1942)
C.R. Crowell, S.M. Sze: Solid State Electron. 9, 1035 (1966)
H. Ibach, H. Luth: Solid-State Physics - An Introduction to Theory and Experiment (Springer, Berlin, Heidelberg 1991 )
C.R. Crowell, J.C. Sarace, S.M. Sze: Trans. Met. Soc. AIME 233, 478 (1965)
S.R. Forrest: Measurement of energy band offsets using capacitance and current measurement techniques in Heterojunction Band Discontinuities: Physics and Device Applications, ed. by F. Capasso, G. Margaritondo ( Elsevier, Amsterdam 1987 ) p. 311
J. Batey, S.L. Wright: J. Appl. Phys. 59, 200 (1986)
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© 1993 Springer-Verlag Berlin Heidelberg
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Lüth, H. (1993). Metal-Semiconductor Junctions and Semiconductor Heterostructures. In: Surfaces and Interfaces of Solids. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-10159-9_8
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DOI: https://doi.org/10.1007/978-3-662-10159-9_8
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-662-10161-2
Online ISBN: 978-3-662-10159-9
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