Abstract
Polycrystalline silicon (poly-Si) plays an important role in the electronic devices of today. Several advantages are offered by poly-Si, which makes it one of the most important fundamental developments in the history of integrated circuits. First, from a structural point of view, poly-Si matches the mechanical properties of single-crystal Si, has good step coverage if deposited by CVD, has a high melting point, forms an adherent oxide, and is compatible with HF. From the device fabrication side, it absorbs and re-emits dopants, it neutralizes heavy metals (gettering), it has a compatible work function for MOS devices, and it forms high-conductivity silicides.
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Slaoui, A., Siffert, P. (2004). Polycrystalline Silicon Films for Electronic Devices. In: Siffert, P., Krimmel, E.F. (eds) Silicon. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-09897-4_4
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