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Compact Camera for Holography with a 670 nm Semiconductor Laser Without Vibration Insulation

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Laser in der Technik / Laser in Engineering

  • 15 Accesses

Abstract

We present a compact camera for holographic interferometry equipped with a semiconductor laser as the source of coherent radiation. The setup is extremely simple, alignment and operation are very easy. Due to its rigidness a sophisticated vibration insulation is not necessary, in contrary to the practice elsewhere in industrial holography.

The holograms are recorded on photo-thermoplastic film. Interferograms can be generated by double exposure or in real time. They are evaluated with the aid of a commercial holographic image processing system using phase stepping. Owing to its ease in operation and its relatively low cost this camera opens new applications for holographic interferometry in the fields of industrial nondestructive testing.

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Author information

Authors and Affiliations

  1. Institut für Innovation und Transfer Automatisierungssysteme, Fachhochschule Ulm, Prittwitzstr. 10, D-89028, Ulm/Donau, Deutschland

    B. Lau & E. Mattes

Authors
  1. B. Lau
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  2. E. Mattes
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Editor information

Editors and Affiliations

  1. Universität München, Neuherberg, Deutschland

    Wilhelm Waidelich (Universitätsprofessor, em. Vorstand des Instituts für Medizinische Optik, em. Direktor des Instituts für Angewandte Optik der Gesellschaft für Strahlen- und Umweltforschung) (Universitätsprofessor, em. Vorstand des Instituts für Medizinische Optik, em. Direktor des Instituts für Angewandte Optik der Gesellschaft für Strahlen- und Umweltforschung)

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© 1994 Springer-Verlag Berlin Heidelberg

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Lau, B., Mattes, E. (1994). Compact Camera for Holography with a 670 nm Semiconductor Laser Without Vibration Insulation. In: Waidelich, W. (eds) Laser in der Technik / Laser in Engineering. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-08251-5_39

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  • DOI: https://doi.org/10.1007/978-3-662-08251-5_39

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-57444-6

  • Online ISBN: 978-3-662-08251-5

  • eBook Packages: Springer Book Archive

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