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Problems Related to X-Ray Stress Analysis in Thin Films in the Presence of Gradients and Texture

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Diffraction Analysis of the Microstructure of Materials

Part of the book series: Springer Series in Materials Science ((SSMATERIALS,volume 68))

Abstract

Surface processing such as grinding, shot-peening, case hardening or coating deposition, is well known today to give rise to complex residual stress fields in the near-surface region of polycrystalline materials, which may vary strongly with depth [1–3]. Because these stresses influence the properties of technical components, such as resistance to abrasive wear or corrosion, to a large extent, detailed knowledge of both their amount and distribution is of increasing interest. Therefore, strong efforts are made in order to develop and to improve suitable methods for their detection. In this connection, non-destructive diffraction methods play a role, because they yield the phase-specific lattice spacings and, thus, the lattice strain in a straightforward and unique way [4].

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  1. C. Genzel
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Editors and Affiliations

  1. Max Planck Institute for Metals Research, Heisenbergstrasse 3, 70569, Stuttgart, Germany

    Eric J. Mittemeijer

  2. Dipartimento di Ingegneria dei Materiali e Tecnologie Industriali, Università di Trento, Facoltà di Ingegneria, Via Mesiano 77, 38050, Mesiano, Italy

    Paolo Scardi

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Genzel, C. (2004). Problems Related to X-Ray Stress Analysis in Thin Films in the Presence of Gradients and Texture. In: Mittemeijer, E.J., Scardi, P. (eds) Diffraction Analysis of the Microstructure of Materials. Springer Series in Materials Science, vol 68. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-06723-9_18

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  • DOI: https://doi.org/10.1007/978-3-662-06723-9_18

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-07352-6

  • Online ISBN: 978-3-662-06723-9

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