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Equipment Used in CMP Processes

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Chemical-Mechanical Planarization of Semiconductor Materials

Part of the book series: Springer Series in Materials Science ((SSMATERIALS,volume 69))

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Abstract

Chemical mechanical planarization is an enabling technology for fabrication of leading edge semiconductor devices. Originally considered to be “dirty” and incompatible with cleanroom processes, CMP has evolved into a critical process technology that includes not only the planarization step, but the post-CMP cleaning process as well. It is used not only in back end of the line interconnect processes, but is also used for critical process steps in the fabrication of transistors and other key device elements — where control of contamination is crucial if the device is to be functional. The evolution of dry-in dry-out CMP equipment platforms has been key to the introduction of CMP processes in mainstream semiconductor manufacturing beginning with the 0.35 p.m technology node. If CMP is a key enabler in the manufacture of advanced semiconductor devices, then evolution of equipment platforms has enabled the use of CMP processes consistent with high volume manufacturing in a clean room environment. Going forward, automated process control for CMP will lead to further improvements in manufacturability, stability and predictive process results.

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Authors
  1. Thomas Tucker
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Editors and Affiliations

  1. Rodel Inc., 14625 NW Skyline Boulevard, 97231, Portland, OR, USA

    Michael R. Oliver (Rodel Fellow) (Rodel Fellow)

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© 2004 Springer-Verlag Berlin Heidelberg

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Tucker, T. (2004). Equipment Used in CMP Processes. In: Oliver, M.R. (eds) Chemical-Mechanical Planarization of Semiconductor Materials. Springer Series in Materials Science, vol 69. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-06234-0_5

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  • DOI: https://doi.org/10.1007/978-3-662-06234-0_5

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-07738-8

  • Online ISBN: 978-3-662-06234-0

  • eBook Packages: Springer Book Archive

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