Abstract
Chemical Mechanical Planarization (CMP) was introduced initially into semiconductor processing to planarize inter-level dielectrics. This technology enabled a greatly improved multi-level metallization integration approach. Once the technology was implemented into large scale manufacturing, both the hardware and the processes evolved by leaps and bounds. New processes were developed, with the second major application being tungsten polish.
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References
L.M. Cook, J. Non-Crystalline Solids, vol. 120, 152, 1990.
A.S. Lawing, Proceedings 2002 CMP-MIC Conference, 310, IMIC, Tampa, 2002.
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Oliver, M.R. (2004). Introduction. In: Oliver, M.R. (eds) Chemical-Mechanical Planarization of Semiconductor Materials. Springer Series in Materials Science, vol 69. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-06234-0_1
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DOI: https://doi.org/10.1007/978-3-662-06234-0_1
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-07738-8
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