Abstract
Figure.2.1 represents the flow of a compressible liquid through a resistance. Since it is compressible, the volume flow and entropy flow change in the passage of the resistance which we have represented by the word bond graph (Fig. 2.1b) RECO or REsistance of COnvection. We have shown this multiport by the symbol RECO instead of the usual R for resistance in the other manuals. We use here a pseudo bond graph with multibonds to model the coupling of thermal and hydraulic energy. Further, the bonds carry a ring around in order to indicate that it is a multibond. Until now, the bond graphers [Karnopp, 1979] used another symbolism, to distinguish bonds, a hydraulic in full line and a thermal bond in dotted lines. This representation is not practical for the modelling of complex systems.
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References
Borel, L., “Thermodynamique et Energétique”, Presses Universitaires Romandes, Swizerland, 1984.
Karnopp, D. K, “State Variables and Pseudo Bond Graphs for Compressible Thermofluid Systems”, Trans. ASME J. DSMC, Vol. 101, pp. 201204, 1979.
Ould Bouamama, B., Thoma J. U., Cassar J.P. “Bond graph Modelling of Steam Condensers”. In: IEEE, International Conference on Systems, Man, and Cybernetic, Vol.3. pp. 2490–2494, Orlando USA october 16–17 1997.
Paul Ove et al. Paul Ove M. et Al. “Thermodynamic Modelling interpreted through Bond Graphs” ESS 95, Erlangen-Nuremberg, Norvegian Institue of technology,pp.292–296, oct.95.
Prandtl, L., “Essentials of Fluid Dynamics”, Blackie, London, 1952.
Thoma, J. U., “Modern Oilhydraulic Enginnering”, Trade and Technical Press Ldt, Morden, Surrey, England, 1971.
Thoma, J. U., “Introduction to Bond graphs and their Applications”, Pergamon Press, 1975.
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© 2000 Springer-Verlag Berlin Heidelberg
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Thoma, J., Bouamama, B.O. (2000). Modelling of Thermofluids. In: Modelling and Simulation in Thermal and Chemical Engineering. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-04181-9_2
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DOI: https://doi.org/10.1007/978-3-662-04181-9_2
Publisher Name: Springer, Berlin, Heidelberg
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