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Process integration

  • Chapter
Technology of Integrated Circuits

Part of the book series: Springer Series in ADVANCED MICROELECTRONICS ((MICROELECTR.,volume 2))

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Abstract

The basic elements of an entire manufacturing process for an integrated circuit have already been described in Chap. 2. This chapter provides a more detailed description of the architecture of the key technologies currently in world-wide use, or to be introduced in the near future.

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References

  1. Shimizu, S.; Kusunoki, S.; Kobayashi, M.; Yamaguchi, T.; Kuroi, T.; Fujino, T.; Maeda, H.; Tsutsumi, T.; Hirose, Y.: IEDM Techn. Digest (1994) 67

    Google Scholar 

  2. Gossner, H.; Eisel, I.; Risch, L.: Jpn. J. Appl. Phys. 33 (1994) 2423

    Google Scholar 

  3. Preussger, A.; Glenz, E.; Heift, K.; Malek, K.; Schwetlick, W.; Wiesinger, K.; Werner, W.M.: Proc. 3rd Intern. Symp. on Power Semicond. Devices and IC’s (1991) 195

    Google Scholar 

  4. Bauer, F.; Stockmeier, T.; Lendenmann, H.; Dettmer, H.; Fichtner, W.: Elektrotechnik, Heft 3 (1994) 18

    Google Scholar 

  5. Stoisiek, M.: Siemens AG, Private communications

    Google Scholar 

  6. Rein, H.M.: Informationstechnik 34 (1992) 209

    Google Scholar 

  7. Meister, T.F.; Stengl, R.; Weyl, R.; Packan, P.; Schreiter, R.; Popp, J.; Klose, H.; Treitinger, L.: IEDM Techn. Digest (1992) 401

    Google Scholar 

  8. Rein, H.M.: Proceedings ESSDERC (1995)

    Google Scholar 

  9. Bertagnolli, E.: Siemens AG, Private communications

    Google Scholar 

  10. Eimori, T.; Ohno, Y.; Kimura, H.; Matsufusa, J.; Kishimura, S.; Yoshida, A.: IEDM Techn. Digest (1993) 631

    Google Scholar 

  11. Masuoka, E: Symp. on VLSI Technology Digest of Techn. Papers (1992) 6

    Book  Google Scholar 

  12. Heinrich, R.; Heinrigs, W.; Tempel, G.; Winnerl, J.; Zettler, T.: IEDM Techn. Digest (1993) 620

    Google Scholar 

  13. Onishi, S.; Hamada, K.; Ishihara, K.; Ito, Y.; Yokoyama, S.; Kudo, J.; Sakiyama, K.: IEDM Techn. Digest (1994) 843

    Google Scholar 

  14. Kiewra, E.; Eckstein, E.; Cote, W.; Hunt, D.; Kocon, W.; Restaino, D.; Wangemann, K.; Feldner, K.; Leslie, T.; Henkel, W.; Roehl, S.; Giammarco, N.; Radens, C.: Proceedings 12th VMIC (1994) 359

    Google Scholar 

  15. Koburger, C.; Adkisson, J.; Clark, W.; Davari, B.; Geissler, S.; Givens, J.; Hansen, H.; Holmes, S.; Lee, H.K.; Lee, J.; Luce, S.; Martin, D.; Mittl, S.; Nakos, J.; Stiffler, S.: Symp. on VLSI Technology Digest of Techn. Papers (1993) 441

    Google Scholar 

  16. Arden, W; Roehl, S.; Sauert, W.: Siemens AG, Private communications

    Google Scholar 

  17. Müller, K.H.; Poehle, H.; Werner, W.: Siemens AG, Private communications

    Google Scholar 

  18. Lachner, R.; Werner, W: Siemens AG, Private communications

    Google Scholar 

  19. Nesbit, L.; Alsmeier, J.; Chen, B.; DeBrosse, J.; Fahey, P.; Gall, M.; Gambino, J.; Gernhardt, S.; Ishiuchi, H.; Kleinhenz, R.; Mandelman, J.; Mii, T.; Morkado, M.; Nitayama, A.; Parke, S.; Wong, H.; Bronner, G.: IEDM Digest of Techn. Papers (1993) 627

    Google Scholar 

  20. Mader, H.: AEC, Band 42 (1988) 118

    Google Scholar 

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Authors and Affiliations

  1. semiconductor technology development, Infineon Technologies, Balanstraße 73, D-81609, Munich, Germany

    Dr.-Ing. Dietrich Widmann

  2. Department of Electrical Engineering and Information Technologies, Munich University of Applied Sciences, Lothstraße 34, D-80335, Munich, Germany

    Prof. Dr.-Ing. Hermann Mader

  3. TELA Versicherungs AG, Pranner Straße 8, D-80333, Munich, Germany

    Dr.-Ing. Hans Friedrich

  4. Technical University Munich, Arcisstraße 21, D-80333, Munich, Germany

    Prof. Dr. rer.nat. Walter Heywang & Prof. Dr. techn. Rudolf Müller

Authors
  1. Dr.-Ing. Dietrich Widmann
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  2. Prof. Dr.-Ing. Hermann Mader
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  3. Dr.-Ing. Hans Friedrich
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  4. Prof. Dr. rer.nat. Walter Heywang
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  5. Prof. Dr. techn. Rudolf Müller
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© 2000 Springer-Verlag Berlin Heidelberg

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Widmann, D., Mader, H., Friedrich, H., Heywang, W., Müller, R. (2000). Process integration. In: Technology of Integrated Circuits. Springer Series in ADVANCED MICROELECTRONICS, vol 2. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-04160-4_8

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  • DOI: https://doi.org/10.1007/978-3-662-04160-4_8

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-08547-5

  • Online ISBN: 978-3-662-04160-4

  • eBook Packages: Springer Book Archive

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