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Technology of Integrated Circuits pp 235–248Cite as

Cleaning technology

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Part of the book series: Springer Series in ADVANCED MICROELECTRONICS ((MICROELECTR.,volume 2))

Abstract

In the earlier chapters, frequent mention was made of the damaging effect of contaminants in the silicon substrate, in the various layers and on the surfaces of the integrated circuit. This chapter summarizes the various types of contamination, and describes the measures employed to prevent or remove contami­nants.

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References

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Authors and Affiliations

  1. semiconductor technology development, Infineon Technologies, Balanstraße 73, D-81609, Munich, Germany

    Dr.-Ing. Dietrich Widmann

  2. Department of Electrical Engineering and Information Technologies, Munich University of Applied Sciences, Lothstraße 34, D-80335, Munich, Germany

    Prof. Dr.-Ing. Hermann Mader

  3. TELA Versicherungs AG, Pranner Straße 8, D-80333, Munich, Germany

    Dr.-Ing. Hans Friedrich

  4. Technical University Munich, Arcisstraße 21, D-80333, Munich, Germany

    Prof. Dr. rer.nat. Walter Heywang & Prof. Dr. techn. Rudolf Müller

Authors
  1. Dr.-Ing. Dietrich Widmann
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  2. Prof. Dr.-Ing. Hermann Mader
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  3. Dr.-Ing. Hans Friedrich
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  4. Prof. Dr. rer.nat. Walter Heywang
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  5. Prof. Dr. techn. Rudolf Müller
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© 2000 Springer-Verlag Berlin Heidelberg

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Widmann, D., Mader, H., Friedrich, H., Heywang, W., Müller, R. (2000). Cleaning technology. In: Technology of Integrated Circuits. Springer Series in ADVANCED MICROELECTRONICS, vol 2. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-04160-4_7

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  • DOI: https://doi.org/10.1007/978-3-662-04160-4_7

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-08547-5

  • Online ISBN: 978-3-662-04160-4

  • eBook Packages: Springer Book Archive

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