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Film technology

  • Chapter
Technology of Integrated Circuits

Part of the book series: Springer Series in ADVANCED MICROELECTRONICS ((MICROELECTR.,volume 2))

Abstract

The starting point for the manufacture of an integrated circuit is a monocrystalline silicon wafer. In the course of manufacture, various layers of material are added to the silicon wafer. A pattern is normally produced in these layers, or films, by retaining selected areas, and these patterned films act as electrical interconnects or as isolating and passivating layers. They may also perform a masking, doping or gettering function during integrated circuit manufacture.

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Authors and Affiliations

  1. semiconductor technology development, Infineon Technologies, Balanstraße 73, D-81609, Munich, Germany

    Dr.-Ing. Dietrich Widmann

  2. Department of Electrical Engineering and Information Technologies, Munich University of Applied Sciences, Lothstraße 34, D-80335, Munich, Germany

    Prof. Dr.-Ing. Hermann Mader

  3. TELA Versicherungs AG, Pranner Straße 8, D-80333, Munich, Germany

    Dr.-Ing. Hans Friedrich

  4. Technical University Munich, Arcisstraße 21, D-80333, Munich, Germany

    Prof. Dr. rer.nat. Walter Heywang & Prof. Dr. techn. Rudolf Müller

Authors
  1. Dr.-Ing. Dietrich Widmann
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  2. Prof. Dr.-Ing. Hermann Mader
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  3. Dr.-Ing. Hans Friedrich
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  4. Prof. Dr. rer.nat. Walter Heywang
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  5. Prof. Dr. techn. Rudolf Müller
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© 2000 Springer-Verlag Berlin Heidelberg

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Widmann, D., Mader, H., Friedrich, H., Heywang, W., Müller, R. (2000). Film technology. In: Technology of Integrated Circuits. Springer Series in ADVANCED MICROELECTRONICS, vol 2. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-04160-4_3

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  • DOI: https://doi.org/10.1007/978-3-662-04160-4_3

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-08547-5

  • Online ISBN: 978-3-662-04160-4

  • eBook Packages: Springer Book Archive

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