Abstract
Large-area electronic circuits on thin foil substrates can be made with techniques adapted from conventional printing. Conventional printing can provide a resolution and an overlay registration of 10 μm and ±5 μm, respectively, which will allow making thin-film transistors (TFTs) at densities above 10 000 per square centimeter. An early example is the use of laser-printed toner etch masks for the fabrication of amorphous silicon TFTs. Patterned devices can be made by direct printing, as demonstrated by the jet printing of the active polymer for organic light-emitting diodes (OLEDs). Paper-thin foils of glass, steel, and polyimide can serve as substrates for making TFTs with characteristics comparable to those made on glass plates. Materials options for thin foil substrates are described. A study of the mechanics of films on stiff and compliant foil substrates shows that particularly rugged and flexible device structures can be made when the foils are very thin. Integrating OLEDs with thin-film transistors on steel foil substrates provides an early example of 3-D integrated components for macroelectronics.
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Wagner, S., Gleskova, H., Sturm, J.C., Suo, Z. (2000). Novel Processing Technology for Macroelectronics. In: Street, R.A. (eds) Technology and Applications of Amorphous Silicon. Springer Series in Materials Science, vol 37. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-04141-3_5
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DOI: https://doi.org/10.1007/978-3-662-04141-3_5
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