Abstract
Picosecond- and femtosecond-laser ablation has been proved to be a powerful technique for the patterning of both thermally high-conductance materials and wide-bandgap materials. Because both the influence of heat conduction within the material and screening of the incident laser light are strongly diminished with picosecond pulses, and can even be ignored with femtosecond pulses, material removal is very localized and requires less energy.
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© 2000 Springer-Verlag Berlin Heidelberg
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Bäuerle, D. (2000). Ultrashort-Pulse Laser Ablation. In: Laser Processing and Chemistry. Advanced Texts in Physics. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-04074-4_13
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DOI: https://doi.org/10.1007/978-3-662-04074-4_13
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-08614-4
Online ISBN: 978-3-662-04074-4
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