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Numerical Analysis of the Interface Problem in Continuous Fiber Ceramic Composites

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Computational Materials Design

Part of the book series: Springer Series in Materials Science ((SSMATERIALS,volume 34))

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Abstract

Finite element analysis (FEA) and pushout tests have been used to discuss several key elements of interface debonding in continuous fiber ceramic matrix composites. This study includes (i) the interaction between fiber debonding and a matrix crack, (ii) the interface shear- stress distribution, and (iii) the interface de-bonding criterion. The interface debonding process is simulated including a pre-existing crack in the matrix. This simulation shows that the stability of the pre-existing crack may be affected by interface debonding ahead of it. The interfacial shear-stress distribution during the pushout test is also computed and gives useful information about the interface debonding criterion. Moreover, the numerical results also give a rational explanation for the experimentally observed trends, including the effect of thermally induced stress on the interfacial debonding.

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Author information

Authors and Affiliations

  1. Institute of Industrial Science, The University of Tokyo, 7-22-1, Roppongi, Minato-ku, Tokyo, 106, Japan

    Y. Kagawa

  2. National Research Institute of Metals, 1-2, Sengen, Tsukuba, Ibaraki, 305, Japan

    C. Masuda

Authors
  1. Y. Kagawa
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  2. C. Masuda
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Editor information

Editors and Affiliations

  1. National Research Institute for Metals, 1-2-1 Sengen, Tsukuba-shi, 305 Ibaraki-ken, Japan

    Tetsuya Saito

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© 1999 Springer-Verlag Berlin Heidelberg

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Kagawa, Y., Masuda, C. (1999). Numerical Analysis of the Interface Problem in Continuous Fiber Ceramic Composites. In: Saito, T. (eds) Computational Materials Design. Springer Series in Materials Science, vol 34. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-03923-6_9

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  • DOI: https://doi.org/10.1007/978-3-662-03923-6_9

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-08404-1

  • Online ISBN: 978-3-662-03923-6

  • eBook Packages: Springer Book Archive

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