Abstract
The relationship between particles and wafers in a vacuum can be divided into the following three categories, which will be discussed along with countermeasures against particles:
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1)
Particle adhesion forces
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2)
Particle behavior in vacuum
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3)
Particle generation
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References
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© 1998 Springer-Verlag Berlin Heidelberg
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Kodama, T. (1998). Particle Deposition in Vacuum. In: Hattori, T. (eds) Ultraclean Surface Processing of Silicon Wafers. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-03535-1_8
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DOI: https://doi.org/10.1007/978-3-662-03535-1_8
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-08272-6
Online ISBN: 978-3-662-03535-1
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