Abstract
In order to ensure high device performance and reliability in the next generation of ULSI, what is required of next-generation cleaning? First, the attainment of a high level of cleanliness which corresponds to the levels of miniaturization and high integration. This is the basic cleaning performance, but at levels even higher than have been required in the past. Precision cleaning which sufficiently controls metallic and particle contamination on the wafer is the technology that must be achieved as a prerequisite of device manufacturing. High-performance cleaning is also extremely important to ensure high yields in future mass production. In order to accomplish this goal, it is necessary to establish an even more advanced foundation for cleaning technology.
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© 1998 Springer-Verlag Berlin Heidelberg
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Aoto, N. (1998). Goals for Next-Generation Wafer Cleaning Technology. In: Hattori, T. (eds) Ultraclean Surface Processing of Silicon Wafers. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-03535-1_46
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DOI: https://doi.org/10.1007/978-3-662-03535-1_46
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