Abstract
To remove metallic contaminants from the surface of silicon wafers, a combination of acidic mixtures, such as HF solution, H2SO4-H2O2 mixture, and HC1-H2O2 mixture (SC-2), and alkali mixtures, such as NH4OH-H2O2 (SC-1), is being used at present.
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© 1998 Springer-Verlag Berlin Heidelberg
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Fukazawa, Y. (1998). Wet Cleaning (Part 2): Removal of Metallic Contaminants. In: Hattori, T. (eds) Ultraclean Surface Processing of Silicon Wafers. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-03535-1_34
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DOI: https://doi.org/10.1007/978-3-662-03535-1_34
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