Abstract
In the manufacturing line of semiconductor devices, particles and metallic contaminants on the wafer surface clearly play a major role in device performance, product yield and reliability. Particle adhesion in particular exerts a great influence on yield [1]. Particles are generated by workers, production equipment, and reactions during the process (for example dry etching), and adhere to the wafer. In the semiconductor process, a variety of wet cleaning processes are performed to remove these metallic ions and particles. Table 33.1 shows typical wet cleaning solutions.
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Kawahara, H. (1998). Wet Cleaning (Part 1): Removal of Particulate Contaminants. In: Hattori, T. (eds) Ultraclean Surface Processing of Silicon Wafers. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-03535-1_33
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DOI: https://doi.org/10.1007/978-3-662-03535-1_33
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