Abstract
Similar to CVD, PVD (physical vapor deposition) has an important position among film formation techniques. The most typical PVD technique is sputtering, which is used to produce aluminum alloys or barrier films with metals having a high melting point, and is used mainly for metal film formation. The makers of sputtering systems for semiconductors are continuing their efforts to:
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1)
improve the step coverage
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2)
suppress particles and other contaminations
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3)
lower the cost of ownership (COO)
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4)
improve the film quality
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5)
develop techniques applicable for larger diameter wafers.
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© 1998 Springer-Verlag Berlin Heidelberg
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Takahashi, T. (1998). Physical Vapor Deposition. In: Hattori, T. (eds) Ultraclean Surface Processing of Silicon Wafers. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-03535-1_25
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DOI: https://doi.org/10.1007/978-3-662-03535-1_25
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-08272-6
Online ISBN: 978-3-662-03535-1
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