Abstract
To maintain the high level of cleanliness of a semiconductor fabrication line, monitoring and control techniques are indispensable. Table 19.1 shows the clean level monitoring items (particle, contamination, charge build-up and thermal and mechanical stressing), the impacts on device characteristics, and the corresponding evaluation techniques [1].
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© 1998 Springer-Verlag Berlin Heidelberg
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Yoneda, K. (1998). Clean Level Monitoring in Production Lines. In: Hattori, T. (eds) Ultraclean Surface Processing of Silicon Wafers. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-03535-1_19
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DOI: https://doi.org/10.1007/978-3-662-03535-1_19
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