Abstract
On the semiconductor production line, in addition to shortening the time required to fabricate devices, in order to ensure high yield in mass production it is important to thoroughy control, reduce, and prevent the particles generated by each process step (see Fig. 17.1).
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© 1998 Springer-Verlag Berlin Heidelberg
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Hattori, T. (1998). Detection and Analysis of Particles in Production Lines. In: Hattori, T. (eds) Ultraclean Surface Processing of Silicon Wafers. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-03535-1_17
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DOI: https://doi.org/10.1007/978-3-662-03535-1_17
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-08272-6
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