Analysis and Evaluation of Molecules Adhered to Wafer Surfaces
During LSI fabrication, the wafer is influenced by contact with the surrounding environment, including the equipment, human beings, the atmosphere, chemicals, water, and gas. As a result, in addition to particles and the native oxide film, organic molecules, water, and atomic contaminants such as chemical residue, mobile ions, and metals also attach to the wafer. Furthermore, during film formation or etching, stress occurs. The micro-roughness of the surface increases during cleaning, and some defects existing in the crystal structure are manifested.
KeywordsInductively Couple Plasma Mass Spectrometry Wafer Surface Desorption Spectrum Thermal Desorption Spectrum Mono Hydride
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