Chip Packaging

Abstract

A practical storage unit or other bubble device will include multiple chips packaged together and the package must supply the electrical connections to the chips and the environment required for their operation (bias field, drive field, control currents, temperature stability, etc.). In general, the bubble components are incorporated in the packaging scheme used for semiconductor and other electronic components. Since these schemes are well known and adequately covered in the literature we need not discuss them here. However, we briefly discuss some of the factors that are unique to bubble devices. First we identify the ingredients, peculiar to bubble chips, that must be supplied by the packaging and then how those ingredients are distributed in the several levels of the packaging hierarchy (module, card, board). We will pay particular attention to the factors that limit the chip area which can be included in a single module.