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Grain Boundary Structure in S-WEB Silicon Ribbon

  • Conference paper
Polycrystalline Semiconductors

Part of the book series: Springer Proceedings in Physics ((SPPHY,volume 35))

Abstract

Electrical activity and structure of the defects in S-WEB silicon ribbon are characterized by EBIC and TEM, resp. The EBIC indicates electrical activity at grain boundaries other than coherent and symmetrical twin boundaries, and at dislocations attached to these boundaries as well as occurring in the grain volume. The analysis by TEM shows that the structure of the ribbon is dominated by Σ=3 twin boundaries, which may react to form short segments of Σ=9 second order twin boundaries. No twin boundaries of even higher order are encountered in this investigation.

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References

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Author information

Author notes

  1. P. Vanko

    Present address: Technical University Budapest, 1521, Budapest, Hungary

Authors and Affiliations

  1. Technical University Hamburg-Harburg, D-2100, Hamburg 90, Fed. Rep. of Germany

    P. Vanko & H. P. Strunk

  2. Siemens Research Laboratories, D-8000, München 83, Fed. Rep. of Germany

    J. G. Grabmaier

Authors
  1. P. Vanko
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  2. H. P. Strunk
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  3. J. G. Grabmaier
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Editor information

Editors and Affiliations

  1. Department of Materials Science and Engineering, Case Western Reserve University, Cleveland, OH, 44106, USA

    Hans J. Möller

  2. Technische Universität Hamburg-Harburg, D-2100, Hamburg 90, Fed. Rep. of Germany

    Horst P. Strunk

  3. Max-Planck-Institut für Festkörperforschung, Heisenbergstr. 1, D-7000, Stuttgart 80, Fed. Rep. of Germany

    Jürgen H. Werner

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© 1989 Springer-Verlag Berlin, Heidelberg

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Vanko, P., Strunk, H.P., Grabmaier, J.G. (1989). Grain Boundary Structure in S-WEB Silicon Ribbon. In: Möller, H.J., Strunk, H.P., Werner, J.H. (eds) Polycrystalline Semiconductors. Springer Proceedings in Physics, vol 35. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-93413-1_26

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  • DOI: https://doi.org/10.1007/978-3-642-93413-1_26

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-93415-5

  • Online ISBN: 978-3-642-93413-1

  • eBook Packages: Springer Book Archive

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