Abstract
Correlations between electrical activity and microstructure in special silicon grain boundaries are presented. EBIC and TEM were performed on the same samples. Three examples of special silicon grain boundaries (Σ = 3, 5, 25) are presented where TEM has been carried out on zones previously characterized by EBIC. In the Σ = 3 case, electrical activity arises when both possible twin planes ({111} and {112}) are present, it is associated with some of the dislocations separating these planes. In the Σ = 5 case, electrical activity is related to the secondary dislocation core structure. In the Σ = 25 case, it has no obvious relation with structure. EBIC-contrast is enhanced by annealing in all cases. Microanalysis of the Z = 25 shows that copper and nickel-based precipitates are implicated in that increase.
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© 1989 Springer-Verlag Berlin, Heidelberg
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Maurice, JL., Colliex, C. (1989). Electron Beam Induced Current Contrast and Transmission Electron Microscopy Analysis of Special Grain Boundaries in Silicon. In: Möller, H.J., Strunk, H.P., Werner, J.H. (eds) Polycrystalline Semiconductors. Springer Proceedings in Physics, vol 35. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-93413-1_11
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DOI: https://doi.org/10.1007/978-3-642-93413-1_11
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